Chipless RFID Tag Substrate for Stronger Resonance and Readout

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Solution Overview

Problem

Existing chipless RFID tags face challenges in read performance and manufacturing cost due to the materials used in their construction, which affect the signal level and resonance characteristics, and there is a need to improve coding capacity and industrial manufacturing efficiency.

Innovation Solution

The use of a dielectric substrate, such as solid foam or fabric, with low permittivity and low loss tangent, combined with a conductive pattern, enhances resonance characteristics and radiation efficiency, allowing for improved read performance and easier manufacturing of chipless RFID tags.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional dielectric substrates with high permittivity are used in chipless RFID tags, then resonance characteristics are enhanced, but read performance deteriorates due to reduced signal level

Engineering Contradiction:
Improveresonance characteristicsVSAvoidread performance
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent changes the dielectric parameter (permittivity) of the substrate from traditional high values to low values (εr < 3), which fundamentally alters the resonance mechanism to improve signal level and read performance while maintaining acceptable resonance characteristics through geometric optimization of the resonators

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies local quality optimization by using low permittivity material for the substrate while maintaining specific geometric characteristics of the resonators (such as CSRR structures) to compensate for the reduced dielectric enhancement, creating optimal local electromagnetic conditions for both resonance and signal transmission

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If chipless RFID tags are manufactured using conventional materials and methods, then production cost is reduced, but manufacturing precision and industrial scalability are limited

Engineering Contradiction:
Improveproduction costVSAvoidindustrial manufacturing efficiency
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent specifies precise parameter ranges for the substrate (permittivity εr < 3, loss tangent tan δ < 0.01) that enable compatibility with standard low-cost manufacturing processes while ensuring sufficient manufacturing precision through defined geometric tolerances for the resonator structures

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent separates the substrate selection criteria from the resonator design, allowing independent optimization of each component - the substrate is selected for low cost and ease of manufacture, while the resonator geometry is optimized for precise electromagnetic performance, enabling modular manufacturing approaches

Inventive Principle:
Principle #1Segmentation

3Ease of manufacture

If dielectric substrates with high loss tangent are used, then manufacturing is simplified, but radiation efficiency deteriorates

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidradiation efficiency
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent establishes a critical threshold for the loss tangent parameter (tan δ < 0.01) that balances manufacturing simplicity with radiation efficiency, selecting materials that meet this criterion to ensure low energy losses while remaining compatible with conventional manufacturing processes

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implies the use of composite or engineered dielectric materials that achieve the desired low loss tangent and low permittivity properties while maintaining manufacturability, potentially combining different material layers or structures to optimize both performance and fabrication

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution results in optimal resonance and superior radiation efficiency, enabling effective identification and facilitating the manufacturing of chipless RFID tags with enhanced read performance and reduced production costs.

Implementation Method 1

their conductive geometric characteristics generate a specific behavior, notably a resonant one. This resonance characteristic at a given frequency allows chipless RFID tags to be printed directly onto an object

Methodology Applied
Scientific EffectResonance: Resonance

Implementation Method 2

The use of a dielectric substrate, such as solid foam or fabric, with low permittivity and low loss tangent, combined with a conductive pattern, enhances resonance characteristics and radiation efficiency

Methodology Applied
Scientific EffectElectromagnetic radiation:

Data Source

PatentEP4107666B1Chipless RFID chip
Publication Date: 2025.12.17 IDYLLIC TECH
  • EP4107666B1 patent drawingFigure 1

AI summary

The present invention relates to a radio frequency identification device (RFID) without (personalized) chip, in particular to a RFID tag without (personalized) chip, also referred to as chipless RFID tag.