Concurrent Chiplet Boot-Up Sequences for SoC Latency Reduction
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Solution Overview
Problem
The boot-up process of chiplet-based System-on-Chip (SoC) devices is complex and time-consuming due to increased features and inter-dependency between chiplets, which can impact execution time and performance.
Innovation Solution
Implementing at least partially concurrent or overlapping boot-up sequences for multiple chiplets in an SoC, where a first chiplet executes a boot-up sequence and outputs a trigger signal to initiate a second boot-up sequence in a second chiplet, allowing the sequences to overlap in time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sequential boot-up sequences are used for multiple chiplets, then reliability and validation can be ensured, but boot-up time increases significantly
Solution Approach 1:
The patent implements preliminary actions by having the first chiplet execute validation tests on the second chiplet's subsystems before the second chiplet actually boots up. This allows the second chiplet to be pre-validated and ready, reducing its actual boot-up time while maintaining reliability through pre-performed validation checks.
Solution Approach 2:
The patent enables continuous useful action by overlapping the boot-up sequences of multiple chiplets. While the first chiplet is booting, the second chiplet can simultaneously execute its boot-up sequence and validation tests, eliminating idle waiting time and maintaining continuous productive work across the system.
2Loss of time
If concurrent boot-up sequences are implemented for multiple chiplets, then boot-up time is reduced, but system complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the boot-up process into distinct phases: execution phase (running boot-up sequences) and validation phase (testing subsystems). This segmentation allows concurrent execution of multiple chiplet boot sequences while managing complexity through structured organization of validation tasks.
Solution Approach 2:
The first chiplet acts as an intermediary that coordinates the concurrent boot-up process. It manages the execution and validation of multiple chiplets, orchestrating the complex concurrent operations without requiring a centralized external controller, thus reducing overall system complexity.
3Reliability
If validation tests are performed on all subsystems during boot-up, then reliability is improved, but boot-up time increases
Solution Approach 1:
The patent performs validation tests as preliminary actions during the overlapping boot-up process. The first chiplet executes validation tests on the second chiplet's subsystems before the second chiplet completes its boot sequence, so that validation is already complete when the chiplet is ready for operation, eliminating dedicated validation time.
Solution Approach 2:
The patent implements partial validation by having the first chiplet perform validation tests on specific subsystems of the second chiplet that are critical or can be validated independently. This partial validation approach provides sufficient reliability assurance without requiring exhaustive testing of every subsystem, reducing overall validation time.
Data Source
AI summary
An integrated circuit device includes a plurality of chiplets. A first chiplet is configured to execute a first boot-up sequence to prepare the first chiplet for operation, and output a trigger signal. A second chiplet is configured to execute a second boot-up sequence to prepare the second chiplet for operation, in response to the trigger signal. The first boot-up sequence at least partially overlaps the second boot-up sequence in time. An example of the integrated circuit device is a System-on-Chip (SoC) that can include various subsystems distributed among multiple chiplets or dies. The boot-up sequences of the subsystems are ordered to increase concurrency between the boot-up sequences. Increasing concurrency of the boot-up sequences between chiplets reduce the overall boot-up time of the SoC.


