Chiplet Fine-Line Carrier Structure With Temporary Transfer Support
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Solution Overview
Problem
Interposer-free packaging technology faces challenges in manufacturing fine lines, warpage control, and mechanical strength during the transfer process, affecting the yield and reliability of the packaging structure.
Innovation Solution
A method involving a temporary bonding layer, pin interconnection layer, fine line interconnection layer, core layer, and build-up layer is used to fabricate a carrier structure, where fine lines are prepared on a temporary carrier, ensuring smooth fabrication and high-density redistribution layers, and the core layer provides mechanical strength support during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If fine lines are manufactured directly on the packaging carrier without a temporary carrier, then the packaging structure can be simplified, but the manufacturing precision and yield of fine lines deteriorate due to difficulty in controlling fabrication quality
Solution Approach 1:
The manufacturing process is segmented into two stages: first fabricating fine lines on a temporary carrier where conditions are optimized for precision, then transferring the completed fine line structure to the final packaging carrier. This segmentation allows each stage to be optimized independently for its specific function.
Solution Approach 2:
The fine lines are preliminarily fabricated on the temporary carrier before the final packaging assembly. This preliminary action allows the fine lines to be created under controlled conditions with proper alignment and precision, then transferred as a complete structure to the packaging carrier.
2Length of moving object
If the packaging carrier is made thin to reduce package thickness, then the integration efficiency is improved, but the mechanical strength during transfer process deteriorates
Solution Approach 1:
The temporary carrier acts as an intermediary support structure during the fabrication and transfer processes. It provides the necessary mechanical strength and stability while fine lines are being manufactured and when the structure is transferred, then is removed after serving its protective function.
Solution Approach 2:
The temporary carrier provides beforehand support and cushioning to the thin packaging carrier structure during vulnerable operations (fabrication and transfer). This prior cushioning prevents mechanical failure during these critical stages, even though the final package will be thin.
3Length of moving object
If the packaging carrier is made thin to reduce package thickness, then the integration efficiency is improved, but the warpage control deteriorates
Solution Approach 1:
The temporary carrier serves as a stable intermediary substrate that compensates for the thin packaging carrier's poor warpage resistance during fabrication. It provides a rigid foundation that maintains dimensional stability and prevents warpage during the fine line manufacturing process.
Solution Approach 2:
The structural parameters (thickness, rigidity) are changed temporarily during fabrication by using the thicker temporary carrier, then reverted to the thin final package structure after transfer. This parameter change allows the thin package to be manufactured with the stability of a thicker structure.
4Productivity
If fine lines are manufactured with higher density to improve integration, then the integration efficiency is improved, but the manufacturing precision requirements increase and yield deteriorates
Solution Approach 1:
The manufacturing process is segmented to allow fine lines to be fabricated at high density on the temporary carrier under optimized conditions, then the complete fine line structure is transferred to the packaging carrier. This segmentation enables high-density fabrication without compromising yield.
Data Source
AI summary
Disclosed are a method for manufacturing a carrier structure suitable for chiplet fine lines and a carrier structure. The method includes: preparing a temporary bonding layer on a temporary carrier, and preparing a pin interconnection layer on the temporary bonding layer, preparing at least one fine line interconnection layer on the pin interconnection layer; preparing a core layer on the at least one fine line interconnection layer with a second electrically conductive structure interconnected with the at least one fine line interconnection layer and/or the pin interconnection layer, preparing at least one build-up layer connected to the fine line interconnection layer on the core layer, and de-bonding the temporary bonding layer to obtain the carrier structure. The solutions can prepare fine lines on a carrier structure and ensure the yield of fine line interconnection lines, thus improving the manufacturability of the fine lines, carrier structure and packaging structure.