Chiplet Cartridge Bonding for Pixel Power and Signal Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing technologies face challenges in efficiently integrating and transferring chiplet cartridges with pixel elements, particularly in forming reliable connections and bonding structures that support power, control signals, and data transmission between microdevices and chiplets within a cartridge structure.
Innovation Solution
A method for fabricating and transferring chiplet cartridges involves forming pads on micro chiplets, bonding microdevices, creating interconnections and optical layers, thinning the backside, forming VIAs, and bonding the microdevice side to cartridge layers, ensuring secure coupling of chiplet pads to system substrates for power and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chiplet cartridges with pixel elements are integrated using conventional bonding methods, then connections between microdevices and chiplets can be established, but the reliability and efficiency of power and signal transmission are insufficient
Solution Approach 1:
The chiplet cartridge structure is divided into distinct functional segments: a first chiplet containing pixel driving circuits, a second chiplet containing microdevices (microLEDs), and a substrate. This segmentation allows each component to be optimized and fabricated separately, then bonded together with high reliability through specialized bonding interfaces, while maintaining integration efficiency through modular assembly processes.
Solution Approach 2:
The substrate acts as an intermediary component that facilitates reliable electrical connections between the first chiplet and the second chiplet. The substrate includes bonding pads and conductive structures that mediate the electrical interface, ensuring stable power and signal transmission while enabling efficient integration of the separate chiplet components.
2Strength
If multiple bonding steps are performed to integrate chiplets and microdevices, then secure connections are achieved, but the fabrication process complexity increases
Solution Approach 1:
Bonding pads are pre-formed on the substrate before chiplet attachment. The first chiplet is bonded to the substrate with its bonding pads aligned to the pre-prepared bonding pads on the substrate. This preliminary preparation simplifies the overall fabrication process by establishing a stable foundation before subsequent bonding steps, reducing process complexity while maintaining strong bonding.
Solution Approach 2:
The bonding operations are combined into an integrated bonding process where the first chiplet and second chiplet are bonded to the substrate in a coordinated sequence. The bonding process merges multiple bonding steps into a unified workflow, achieving strong connections while managing fabrication complexity through process integration.
3Productivity
If chiplet pads are directly bonded to system substrates, then power and signal transmission is enabled, but the adaptability for different pixel element configurations is limited
Solution Approach 1:
The substrate is designed with universal bonding pads and conductive structures that can accommodate different chiplet configurations and pixel element arrangements. The bonding interface is formulated to be adaptable, allowing the same substrate design to support various pixel element types and configurations while maintaining efficient power and signal transmission through standardized bonding protocols.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable integration and transfer of chiplet cartridges with pixel elements, facilitating secure connections and efficient power, control signal, and data transmission between microdevices and chiplets, enhancing the functionality and reliability of the cartridge structure.
Implementation Method 1
having the second set of pads bonded to a system substrate and coupled to electrodes on the system substrate
Data Source
AI summary
The present invention discloses cartridge structure and chiplets and cartridge layers. The invention further discloses, method of transferring pixel elements with chiplet cartridge structure and also various methods of fabrication for pixel elements having chiplet cartridge.