Chiplet Chuck Tip-Tilt Control for Conforming Bonding
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Solution Overview
Problem
Unobserved tip-tilt errors between chiplets and substrates during bonding introduce significant alignment errors, complicating the precise alignment of electrical pads on chiplets with those on substrates.
Innovation Solution
A system and method involving actuators to control the movement of a chiplet chuck while maintaining a set tip-tilt, detecting contact with the substrate, and adjusting forces to satisfy a predetermined condition, ensuring precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If tip-tilt control is maintained during the entire bonding process, then alignment precision is improved, but the chiplet cannot conform to substrate surface variations
Solution Approach 1:
The system dynamically switches between two control modes: tip-tilt control mode during approach to maintain alignment precision, and force control mode during contact to allow surface conformance. This dynamic transition resolves the contradiction by applying the appropriate control strategy at the appropriate stage of the bonding process.
Solution Approach 2:
The system performs preliminary alignment with tip-tilt control before contact is made, ensuring that the chiplet is properly aligned with the substrate pads before bonding begins. This preliminary action establishes the precise alignment needed while avoiding the contradiction during the actual bonding contact.
2Adaptability or versatility
If force control is used from the beginning, then surface conformance is improved, but alignment precision deteriorates due to tip-tilt errors
Solution Approach 1:
The system dynamically transitions from tip-tilt control mode to force control mode at the moment of contact detection. This dynamic switching allows the system to avoid tip-tilt errors during approach while enabling surface conformance during bonding, resolving the contradiction between the two control strategies.
Solution Approach 2:
The system uses feedback from actuator force measurements to detect contact between the chiplet and substrate. When contact is detected (force exceeds threshold), the system switches control modes. This feedback mechanism ensures that force control is applied at the optimal moment to achieve surface conformance without compromising alignment precision.
3Manufacturing precision
If tip-tilt is maintained during contact, then alignment is preserved, but bonding quality deteriorates due to inability to conform to surface variations
Solution Approach 1:
The system dynamically switches control modes at contact detection: maintaining tip-tilt control during approach to preserve alignment, then transitioning to force control during contact to enable surface conformance and ensure bonding quality. This dynamic approach resolves the contradiction between alignment preservation and bonding quality.
Solution Approach 2:
The system performs preliminary alignment preservation with tip-tilt control before contact, then switches to force control for bonding. This preliminary action ensures alignment is established and maintained until the moment contact occurs, at which point force control enables proper bonding without compromising the previously established alignment.
4Adaptability or versatility
If tip-tilt control is released during contact, then surface conformance is improved, but alignment errors increase due to unobserved tip-tilt errors
Solution Approach 1:
The system performs preliminary alignment with tip-tilt control before contact, establishing accurate alignment. Then at contact detection, it switches to force control that maintains the previously established alignment while enabling surface conformance. This preliminary action ensures alignment accuracy is preserved even when tip-tilt control is released during contact.
Solution Approach 2:
The system uses feedback from the actuator force measurements to detect contact and trigger the control mode switch. This feedback ensures that tip-tilt control is released at the optimal moment (upon contact detection) to enable surface conformance while maintaining the alignment accuracy established during the approach phase.
Data Source
AI summary
Some devices, systems, and methods control a plurality of actuators to move a chiplet chuck holding a chiplet toward a substrate while maintaining a set tip-tilt of the chiplet chuck; detect contact of the chiplet with the substrate based on a change of a force applied to the chiplet chuck by at least one actuator of the plurality of actuators while maintaining the set tip-tilt of the chiplet chuck; and, after detecting the contact of the chiplet with the substrate, control the plurality of actuators to move the chiplet chuck toward the substrate without maintaining the set tip-tilt of the chiplet chuck and adjusting a respective force that each actuator of the plurality of actuators applies to the chiplet chuck such that a predetermined condition is satisfied.