Chiplet Connection Posts for Reliable Backplane Interconnects
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Solution Overview
Problem
Existing methods for electrically interconnecting small integrated circuits, such as micro transfer printed chiplets, to destination substrates are costly and complex, requiring multiple manufacturing steps and facing challenges with topographical differences between the chiplets and the substrate, which complicates the formation of continuous conductors and increases the risk of electrical faults.
Innovation Solution
The solution involves micro transfer printing chiplets with electrically conductive connection posts that protrude from the component surface, allowing for mechanical pressure to drive these posts into backplane contact pads, potentially deforming them to create a wedged and welded connection, and optionally using a solder layer for additional adhesion and connection, along with redundant connection posts to reduce faults.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional methods are used to electrically interconnect chiplets to backplane contact pads, then electrical connection is achieved, but the process is costly and complex requiring multiple manufacturing steps
Solution Approach 1:
Connection posts are pre-formed on the chiplet surface before transfer printing. This preliminary formation of conductive structures eliminates the need for complex post-assembly electrical connection steps, reducing manufacturing process complexity while ensuring reliable electrical interconnection between chiplets and backplane contact pads
Solution Approach 2:
The electrical connection function is extracted from the traditional multi-step manufacturing process and integrated into the chiplet structure itself through pre-formed connection posts. This extraction simplifies the overall manufacturing process by combining electrical interconnection with the chiplet fabrication stage
2Reliability
If traditional interconnection methods are used, then electrical connection is formed, but topographical differences between chiplets and substrate complicate continuous conductor formation
Solution Approach 1:
The connection posts extend in the vertical dimension from the chiplet surface, bridging the topographical gap between the chiplet and backplane substrate. This three-dimensional approach to electrical connection eliminates the need for complex lateral conductor routing that would be required to accommodate surface height differences
Solution Approach 2:
The connection posts serve as intermediary structures that mediate the electrical connection between the chiplet contact pads and the backplane contact pads. These posts physically and electrically bridge the topographical discontinuity, enabling continuous conductor formation despite surface height variations
3Ease of manufacture
If simple connection methods are used, then manufacturing is simpler, but the risk of electrical faults increases
Solution Approach 1:
Multiple connection posts are distributed at different locations on the chiplet surface, providing localized electrical connection paths. This distribution strategy ensures that if one connection path fails, other localized paths remain intact, maintaining electrical connection reliability while keeping the manufacturing process simple
Solution Approach 2:
Redundant connection posts are pre-positioned on the chiplet before transfer printing. This beforehand provision of alternative connection paths cushions against potential electrical faults, ensuring that even if some connection posts fail to establish proper contact, the system maintains reliable electrical interconnection through the remaining posts
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the electrical interconnection process, reduces manufacturing costs, and enhances reliability by providing robust and redundant connections between chiplets and the destination substrate, while accommodating varying topographies and sizes of components.
Implementation Method 1
mechanical pressure to drive the connection posts into the contact pads
Implementation Method 2
deforming them to create a wedged and welded connection
Implementation Method 3
wedged and welded connection
Implementation Method 4
heating causing the solder to reflow
Implementation Method 5
using a solder layer for additional adhesion and connection
Data Source
AI summary
A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.