Chiplet Connection Posts for Simplified Substrate Interconnects
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Solution Overview
Problem
Existing methods for electrically interconnecting small integrated circuits, such as micro transfer printed chiplets, to destination substrates are costly and complex, requiring multiple manufacturing steps and facing challenges with topographical differences between the chiplets and the substrate.
Innovation Solution
The use of micro transfer printing with electrically conductive connection posts that protrude from the chiplets and are forcefully driven into backplane contact pads, potentially deformed or crumpled to wedge and weld into place, along with optional heat treatment or solder reflow for secure adhesion, allows for efficient and cost-effective electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional pick-and-place technologies are used to interconnect integrated circuits, then assembly is possible, but the process becomes costly and complex with multiple manufacturing steps
Solution Approach 1:
The integrated circuit is segmented into a chiplet with an active surface and a separate support structure. The connection post extends from the active surface through the support structure, allowing the chiplet to be transferred and connected in a simplified single-step process rather than multiple assembly steps.
Solution Approach 2:
The connection post is nested within the support structure, extending from the active surface through the support structure to the opposite side. This nested configuration allows the connection post to be integrated with the chiplet during manufacturing while enabling simplified transfer and connection operations.
2Reliability
If connection posts are driven forcefully into backplane contact pads, then secure adhesion and electrical connection are achieved, but the connection posts and contact pads may be deformed or crumpled
Solution Approach 1:
The support structure acts as a cushioning element between the connection post and the backplane contact pad. During the forceful driving operation, the support structure absorbs and distributes the mechanical stress, preventing excessive deformation or damage to the connection post while still enabling secure adhesion and electrical connection.
3Reliability
If heat treatment or solder reflow is applied to secure adhesion, then robust bonding is achieved, but additional processing steps and thermal stress are introduced
Solution Approach 1:
The adhesion and electrical connection functions are merged into a single operation. The forceful driving of the connection post into the backplane contact pad simultaneously achieves both mechanical adhesion through deformation/crumpling and electrical connection, eliminating the need for separate heat treatment or solder reflow steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the electrical interconnection process, reduces manufacturing costs, and enhances reliability by providing redundant connections and robust adhesion between chiplets and the substrate.
Implementation Method 1
The connection posts, the backplane contact pads, or both the connection posts and backplane contact pads can be deformed or crumpled
Implementation Method 2
An additional heat treatment can be provided to facilitate the welding
Implementation Method 3
a layer of metal, for example a solder can be provided on either the surface of the connection post or the backplane contact pad, or both, that can be heated, causing the solder to reflow
Data Source
AI summary
A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.