Chiplet Control Circuit Segmentation for Display Testing
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Solution Overview
Problem
Existing manufacturing processes for flat-panel display devices face challenges in testing and repairing pixel-control circuits without constructing the displays, leading to inefficiencies and resource wastage due to the inability to identify and correct faults early in the manufacturing process, and there is a need for improved control circuits with higher performance distributed over a substrate.
Innovation Solution
The implementation of an electronic apparatus with a common substrate featuring chiplet locations, where independent chiplets with separate substrates are adhered closer to the common substrate, each equipped with circuitry for controlling electro-optic devices, allowing for electrical connections and enabling test and repair capabilities before the devices are fully constructed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional manufacturing processes are used for flat-panel display devices, then the display can be constructed, but testing and repairing pixel-control circuits becomes difficult or impossible without constructing the displays, leading to inefficiencies and resource wastage
Solution Approach 1:
The pixel-control circuit is segmented into a separate chiplet that can be tested and repaired independently before integration into the display. This segmentation allows the control circuit to be manufactured, tested, and repaired as a standalone component, eliminating the need to construct the entire display for testing purposes.
Solution Approach 2:
The chiplet is tested and repaired before being integrated into the display assembly. This preliminary testing action identifies and corrects faults early in the manufacturing process, preventing waste of resources on defective units that would otherwise require full display construction to detect.
2Reliability
If control circuits are integrated into the display construction, then the display functions, but faults cannot be identified and corrected early in the manufacturing process
Solution Approach 1:
The control circuit is divided into a separate chiplet component rather than being fully integrated into the display construction. This segmentation enables independent testing and fault identification of the control circuit while maintaining the functional integration of the complete display system.
Solution Approach 2:
The chiplet serves as an intermediary component between the control logic and the display elements. It can be tested and repaired independently as an intermediate stage, allowing fault identification before final integration while still enabling the complete display to function when assembled.
3Ease of repair
If chiplets with separate substrates are used, then testing and repair become possible, but the device structure becomes more complex
Solution Approach 1:
The control circuit is implemented as a separate chiplet with its own substrate, physically segmenting it from the main display substrate. This segmentation enables the chiplet to be removed, tested, and repaired independently, significantly improving ease of repair while the modular design helps manage structural complexity.
Solution Approach 2:
The chiplet provides localized functionality for pixel control on a separate substrate. This local quality approach concentrates the control circuitry in a discrete component that can be independently manufactured, tested, and repaired, improving repairability without requiring complex changes to the overall display structure.
Data Source
AI summary
An electronic apparatus including a common substrate, a plurality of controlled electronic devices disposed over the common substrate, and a wiring layer having a plurality of conductors formed on the common substrate. A plurality of chiplets are located over the common substrate, each chiplet having an independent substrate separate from the common substrate, each independent substrate having a bottom side opposing a top side with one or more connection pads formed on the bottom side of the chiplet, and each chiplet including circuitry for controlling functions of one or more of the controlled electronic devices. The chiplets are adhered to the common substrate with the bottom side of the chiplet closer to the common substrate than the top side of the chiplet, and each connection pad is electrically connected to one of the plurality of conductors.