Chiplet Integration for Display Aperture Ratio and Control Performance
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Solution Overview
Problem
Existing active-matrix flat-panel display devices using thin-film semiconductor materials, such as amorphous or polycrystalline silicon, suffer from performance limitations and non-uniformity, leading to increased costs and reduced aperture ratios due to the use of large and less efficient control elements.
Innovation Solution
The implementation of chiplets with crystalline silicon substrates, each including circuitry and connection pads, which are separately manufactured and applied to the display substrate, utilizing a single wiring layer with continuous and discontinuous lines to connect control electrodes and power busses, thereby improving control element performance and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thin-film semiconductor materials (amorphous or polycrystalline silicon) are used for control elements, then manufacturing is simpler and costs are lower, but device performance and uniformity deteriorate
Solution Approach 1:
The patent divides the control element into two separate components: a crystalline silicon chiplet containing the transistor circuitry and a thin-film substrate containing the pixel array. The chiplet is separately fabricated using high-performance crystalline silicon processes and then integrated with the thin-film display substrate. This segmentation allows each component to be optimized independently - the chiplet for high-performance control and the substrate for cost-effective manufacturing and uniformity.
2Ease of manufacture
If thin-film control elements are used, then manufacturing cost is reduced, but aperture ratio decreases due to larger control element size
Solution Approach 1:
The patent transitions from planar integration to three-dimensional integration by stacking the crystalline silicon chiplet on top of the thin-film substrate. This vertical arrangement allows the control element circuitry to occupy a different spatial dimension (height) rather than competing for lateral space on the substrate plane. Consequently, the control elements can be smaller in footprint, increasing the aperture ratio while maintaining cost-effective thin-film manufacturing for the display portion.
3Ease of manufacture
If thin-film control elements are used, then manufacturing is simpler, but control element performance deteriorates
Solution Approach 1:
The patent introduces the crystalline silicon chiplet as an intermediary component that mediates between the high-performance requirements of control elements and the manufacturing simplicity of thin-film processes. The chiplet, fabricated using mature crystalline silicon technology, provides superior transistor performance and is integrated with the thin-film substrate through standardized packaging and bonding techniques. This intermediary approach delivers high-performance control while maintaining overall manufacturing simplicity.
Data Source
AI summary
A display device includes: a substrate; one or more pixels arranged on the substrate, each pixel including a control electrode; a wiring layer located over the substrate, the wiring layer having a continuous line and a discontinuous pass-thru line formed therein. The active-matrix device includes at least one chiplet located over the substrate and including first, second, third, and control connection pads including; a control line electrically connecting the control connection pad to the control electrode; a first end of the discontinuous pass-thru line connected to the first connection pad and a second end of the discontinuous pass-thru line connected to the second connection pad; circuitry electrically connecting the first and second connection pads; and the continuous line electrically connected to the third connection pad, wherein the continuous line extends to opposite sides of the chiplet.