Chiplet Interconnect Transaction Tracking for Timeout Debugging
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in optimizing performance and yield due to the limitations of monolithic chips, particularly in terms of size and manufacturing costs, which can be addressed by utilizing chiplet systems that divide functionalities across multiple dies.
Innovation Solution
An electronic device comprising multiple chiplets with interconnect management modules and registers for tracking transactions, allowing for the detection of transaction timeouts and determining debugging points, thereby optimizing performance and yield through parallel processing and scalable computing environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chiplet systems are used to divide functionalities across multiple dies, then manufacturing yield and scalability are improved, but transaction tracking complexity and debugging difficulty increase
Solution Approach 1:
The patent segments the transaction tracking function by introducing separate interconnect management modules in each chiplet, which independently manage and track transactions within their respective chiplets. This segmentation allows distributed transaction tracking across multiple chiplets, improving scalability while maintaining manageable complexity through modular architecture.
Solution Approach 2:
The patent implements feedback mechanisms through timeout detection and debugging point identification. When a transaction timeout occurs, the system provides feedback by identifying specific debugging points (bus interfaces or interconnect modules) where the timeout occurred, enabling targeted debugging and improving transaction tracking effectiveness in chiplet systems.
2Adaptability or versatility
If multiple chiplets are connected through interconnect modules, then system functionality and performance are improved, but communication overhead and timeout risks increase
Solution Approach 1:
The patent applies preliminary action by implementing timeout detection mechanisms that proactively monitor transaction completion times. Before a transaction can fail completely, the system detects potential timeouts by tracking elapsed time against threshold values, allowing for early intervention and improved communication reliability in multi-chiplet systems.
Solution Approach 2:
The interconnect management modules serve as intermediaries between chiplets, handling transaction coordination and timeout monitoring. These intermediary modules isolate timeout issues to specific segments, preventing system-wide failures and maintaining communication reliability while enabling expanded system functionality across multiple chiplets.
3Ease of repair
If transaction timeout detection is implemented, then debugging efficiency is improved, but device complexity and overhead increase
Solution Approach 1:
The patent extracts the timeout detection and debugging functionality into separate, dedicated components within the interconnect management modules. By isolating these debugging functions from the main transaction processing paths, the system achieves improved debugging efficiency while minimizing the impact on overall device complexity and performance.
Data Source
AI summary
Provided is an electronic device, including a first chiplet including a first bus interface, a first interconnect management module, and a first interconnect module, and a second chiplet connected to the first chiplet through the first interconnect module, wherein, in response to an occurrence of a request transaction associated with the second chiplet, the first interconnect management module stores, in a register, first information associated with the request transaction.