Configurable Chiplet Interface Alignment for Scalable Interposer Routing
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Solution Overview
Problem
Existing semiconductor chiplet designs face limitations due to fixed interface positions, leading to increased costs, development time, and reduced scalability when routing lengths exceed feasible limits, necessitating the creation of new chiplets with tailored interface positions.
Innovation Solution
A semiconductor device with configurable chiplet dies and an interposer, featuring a die-to-die interface with adjustable modules and a selection circuit that allows for variable alignment of connection modules, enabling efficient inter-chiplet communication without the need for new chiplet designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If fixed interface positions are used in chiplet designs, then manufacturing and design simplicity is maintained, but routing length constraints are exceeded and connection feasibility is reduced
Solution Approach 1:
The die-to-die interface incorporates a selection circuit that enables dynamic selection of different connection modules based on the actual routing length requirements. This dynamic adaptability allows the interface to adjust its configuration, resolving the contradiction between maintaining simple fixed-position manufacturing and achieving feasible connections when routing lengths vary.
Solution Approach 2:
The interface structure includes multiple connection modules with different configurations, and the selection circuit changes the operational parameters by selecting which module to activate. This parameter change capability allows the system to adapt to different routing length scenarios without requiring complete redesign, thus maintaining manufacturing simplicity while improving connection feasibility.
2Adaptability or versatility
If new chiplets with tailored interface positions are created to accommodate routing lengths, then connection feasibility is improved, but manufacturing costs and development time increase
Solution Approach 1:
A single chiplet design incorporates multiple connection modules within its die-to-die interface, making it universal enough to handle various routing length requirements. The selection circuit enables this single design to perform multiple functions by activating different modules as needed, eliminating the need to create multiple specialized chiplet versions and thereby reducing manufacturing costs.
Solution Approach 2:
The die-to-die interface is segmented into multiple independent connection modules, each capable of handling specific routing scenarios. This segmentation allows the system to select only the necessary module for each connection, providing adaptability without requiring complete redesign of the chiplet, thus avoiding increased manufacturing costs.
3Adaptability or versatility
If multiple specialized chiplet designs are created for different routing lengths, then connection adaptability is improved, but device complexity and supply chain logistics are complicated
Solution Approach 1:
Instead of creating multiple static specialized designs, the invention implements a dynamic selection mechanism within a single chiplet design. The selection circuit dynamically chooses which connection module to use based on the routing requirements, achieving interface adaptability while maintaining a unified, less complex design structure.
Solution Approach 2:
The selection circuit acts as an intermediary between the multiple connection modules and the external interface requirements. It mediates the selection process, allowing a single chiplet design to adapt to different routing scenarios without requiring multiple specialized designs, thereby reducing overall device complexity and simplifying supply chain logistics.
Data Source
AI summary
A semiconductor device integrates a series of chiplet dies, each configurable as individual semiconductor chips, mounted on an interposer. Each chiplet die is equipped with a die-to-die interface enabling connectivity amongst them. The die-to-die interface in each chiplet includes a first connection module within a first chiplet die, having multiple first modules, and a second connection module within a second chiplet die, having multiple second modules. A selection circuit is used select specific second modules that align with corresponding first modules in the first connection module.