Chiplet Layout Optimization for Lower Inter-Chiplet Energy
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Solution Overview
Problem
The use of chiplets in semiconductor devices leads to increased energy consumption due to inter-chiplet communication, which affects the overall energy efficiency of the device.
Innovation Solution
A layout optimization method is employed to minimize energy consumption by optimizing the placement of chiplets on a base substrate, considering factors such as distance, wiring length, technology nodes, and communication models, using a weighted combination of objectives to determine the optimal chiplet layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chiplets are integrated into a single device by mounting them on a shared base, then cost effectiveness and efficiency are improved, but energy consumption increases due to inter-chiplet communication
Solution Approach 1:
The patent applies local quality by optimizing the placement of specific chiplets based on their communication patterns and functional relationships. The layout algorithm determines optimal positions for each chiplet individually, considering its specific communication requirements with other chiplets, thereby minimizing local communication energy costs while maintaining overall device efficiency.
Solution Approach 2:
The patent introduces a new optimization dimension by considering communication energy consumption as a separate objective function parameter alongside traditional layout concerns. This multi-dimensional optimization approach balances placement density, wiring length, and communication energy to achieve overall energy efficiency improvement.
2Ease of manufacture
If chiplets are placed closer together to reduce wiring length, then manufacturing cost is reduced, but energy consumption increases due to heat generation
Solution Approach 1:
The patent changes the optimization parameters by incorporating thermal considerations into the layout algorithm. It evaluates multiple objective functions including wiring length, communication energy, and thermal management requirements, adjusting chiplet positions to balance manufacturing cost with heat generation constraints.
Solution Approach 2:
The patent employs a dynamic optimization approach where the layout algorithm iteratively adjusts chiplet positions based on multiple competing objectives. The system dynamically balances placement density for cost reduction against thermal separation for heat management, achieving an optimal compromise configuration.
3Ease of operation
If manual placement method is used for chiplets, then design simplicity is maintained, but energy consumption and temperature are higher
Solution Approach 1:
The patent applies preliminary action by performing automated layout optimization during the design phase to determine optimal chiplet positions before manufacturing. This pre-computation of placement based on communication models and objective functions eliminates the need for trial-and-error manual adjustments while achieving superior energy efficiency and thermal management.
Solution Approach 2:
The patent creates an inter-chiplet communication model that replicates actual communication patterns and energy costs. This virtual model allows the optimization algorithm to simulate and evaluate different placement scenarios without physical prototyping, achieving energy efficiency improvements while maintaining design tractability.
Data Source
AI summary
Layout methods and systems include determining an inter-chiplet communication model for chiplets of a semiconductor device design. A layout of the chiplets is optimized using an objective function that is a weighted combination of different objectives. A semiconductor device is fabricated in accordance with the layout of the chiplets by mounting the chiplets to a base substrate.