Chiplet Memory Hub Die-to-Die Interface for High-Bandwidth Interconnects
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Solution Overview
Problem
Integrating multiple functions into a single chip increases wire count, power consumption, heat generation, manufacturing costs, and complexity, limiting bandwidth and causing inefficiencies in semiconductor devices.
Innovation Solution
A chiplet-based memory hub structure using a die-to-die interface with micro bumps on an interposer, allowing direct connections between chips, reducing space and latency, and enabling high-bandwidth data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple functions are integrated into a single chip, then functionality is improved, but wire count and device complexity increase
Solution Approach 1:
The patent divides the semiconductor device into multiple separate chips (first chip, second chip, third chip) that can be independently fabricated and then interconnected through an interposer. This segmentation allows each chip to perform specific functions without requiring all functions to be integrated on a single chip, thereby reducing wire count and device complexity while maintaining overall functionality.
2Productivity
If a large chip area is used to integrate multiple functions, then bandwidth expansion is possible, but manufacturing cost increases due to higher defect rates
Solution Approach 1:
The patent segments the device into multiple smaller chips that can be fabricated separately at optimal process nodes. This allows for better yield management and lower manufacturing costs compared to fabricating a single large chip, while still achieving high bandwidth through the interposer-based interconnection architecture that provides multiple parallel data paths.
Solution Approach 2:
The patent introduces a third dimension by placing chips in a stacked configuration connected through an interposer. This vertical arrangement enables high bandwidth communication without requiring a large planar chip area, thereby avoiding the manufacturing cost penalties associated with large single-chip fabrication.
3Reliability
If conventional bumping process is used, then connection between chips is achieved, but bumps occupy large area and limit bandwidth per unit area
Solution Approach 1:
The patent introduces an interposer as an intermediary substrate that facilitates connections between multiple chips. The interposer provides a platform for implementing fine-pitch micro bump arrays with higher density than conventional direct chip-to-chip bumping, thereby increasing bandwidth per unit area while maintaining reliable electrical connections.
4Reliability
If data path length is increased through physical conductors, then connection is achieved, but transmission speed decreases due to signal degradation
Solution Approach 1:
The interposer serves as an intermediary that enables short-range, high-speed data transmission between adjacent chips. By providing direct electrical pathways through the interposer substrate, the patent minimizes signal path length and reduces signal degradation, thereby maintaining high transmission speeds while achieving reliable inter-chip connections.
Data Source
AI summary
Disclosed is a semiconductor device including a memory hub with a chiplet structure. The semiconductor device includes an interposer, a processor unit placed on the interposer, at least one memory hub placed on the interposer and provided to be physically separated from the processor unit, and at least one memory provided to be physically separated from the memory hub.