Semiconductor Package Optical Interconnect for Chiplet Signal Integrity
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Solution Overview
Problem
As semiconductor technology nodes shrink, integrating multiple functional units into a single ASIC chip decreases yield and leads to signal distortion at higher data rates due to the limitations of copper bonding wires in transmitting signals over longer distances.
Innovation Solution
The use of optical interconnection elements, such as optical fibers, for long-distance signal transmission between chiplets on separate substrates, combined with electrical interconnection elements for short-distance communication, to enhance signal transmission efficiency and reduce distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple functional units are integrated into a single ASIC chip, then device functionality is improved, but manufacturing yield deteriorates
Solution Approach 1:
The patent divides the monolithic ASIC chip into multiple separate chiplets, each containing specific functional units. These chiplets are manufactured independently on separate substrates, allowing for higher individual yield while maintaining overall device functionality through optical interconnection.
2Ease of manufacture
If copper bonding wires are used for signal transmission, then ease of manufacture is improved, but signal transmission quality deteriorates at higher data rates over longer distances
Solution Approach 1:
The patent replaces electrical signal transmission through copper bonding wires with optical signal transmission through optical interconnection elements. This substitution eliminates signal distortion issues at high data rates while maintaining ease of manufacture through standardized optical coupling processes.
3Reliability
If optical interconnection elements are used for long-distance signal transmission, then signal transmission quality is improved, but device complexity increases
Solution Approach 1:
The patent introduces optical interconnection elements as intermediary components between chiplets, enabling high-quality long-distance signal transmission. The complexity is managed by integrating these optical elements into the substrate structure and using standardized coupling mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for effective signal transmission over longer distances at high data rates with reduced distortion, improving the performance and efficiency of semiconductor packages by leveraging the longer transmission capabilities of optical interconnection elements.
Implementation Method 1
The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element
Implementation Method 2
a cladding material encapsulates the first interconnection element and configured to confine light in the first interconnection element
Data Source
AI summary
Semiconductor packages and methods for manufacturing the semiconductor packages are provided. The semiconductor package includes a first electronic element disposed over a first substrate; a second electronic element disposed over a second substrate spaced apart from the first substrate; and a first interconnection element connected to the first electronic element and the second electronic element. The first electronic element extends beyond an edge of the first substrate. The second electronic element extends beyond an edge of the second substrate and towards the first electronic element. The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element.