Chiplet Positioning via Automatic Packet Analysis
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Solution Overview
Problem
The increasing complexity and size of chips due to higher functionality in electronic products make miniaturization difficult, leading to increased manufacturing costs and reduced flexibility in chiplet integration, as pre-set positioning numbers are required for middle chiplets, limiting adaptability and efficiency.
Innovation Solution
A chiplet system that automatically determines and sets positioning numbers for middle chiplets through packet transmission and analysis, eliminating the need for pre-set numbers, allowing flexible connection and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pre-set positioning numbers are required for middle chiplets, then chiplet integration can be achieved, but manufacturing cost increases and flexibility is reduced
Solution Approach 1:
The chiplet system automatically determines positioning numbers through self-identification and packet transmission mechanisms. Each chiplet identifies its own position in the series by receiving and processing packets from end chiplets, eliminating the need for pre-set positioning numbers and reducing manufacturing complexity
Solution Approach 2:
The system performs preliminary classification of end chiplets and middle chiplets before operation. End chiplets are identified and configured to send positioning packets, while middle chiplets are prepared to receive and process these packets, enabling automatic positioning without pre-configuration
2Manufacturing precision
If pre-set positioning numbers are used in semiconductor process, then chiplet positioning is determined, but manufacturing cost increases
Solution Approach 1:
The patent replaces the mechanical/pre-manufacturing positioning system with an electrical/software-based system. Positioning information is transmitted through electrical packets and determined through logical operations rather than physical markings or pre-configuration during semiconductor fabrication
Solution Approach 2:
The system uses packet transmission to copy and transmit positioning information through the chiplet series. Each middle chiplet receives positioning data from the previous chiplet and forwards it, creating a chain of copied information that determines position without requiring unique pre-set numbers
3Adaptability or versatility
If middle chiplets are flexibly connected in series, then manufacturing flexibility increases, but positioning determination becomes more complex
Solution Approach 1:
The positioning determination process is segmented into distinct functional modules: end chiplet identification, packet transmission, middle chiplet position determination, and positioning number assignment. This segmentation simplifies the overall complex process by breaking it into manageable, independent steps
Solution Approach 2:
Positioning packets serve as intermediaries that carry positioning information through the chiplet series. These packets mediate the communication between end chiplets and middle chiplets, enabling flexible connection determination without direct complex interaction between all chiplets
Data Source
AI summary
A chiplet system and a positioning method thereof are provided. The positioning method of the chiplet system includes the following steps. Two end chiplets and a plurality of middle chiplets are classified. A quantity calculation packet is transmitted and accumulated from each of the end chiplets towards another end to analyze a quantity of middle chiplets. A serial number comparison packet is transmitted and accumulated from each of the middle chiplets connected to one of the end chiplets towards another end to set a starting point. An identify number setting packet is transmitted and accumulated from the middle chiplet set as the starting point towards another end to set a positioning number of each of the middle chiplets.