Chiplet Power Domains for Die Variation Performance Balancing
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Solution Overview
Problem
Semiconductor manufacturing variations lead to different circuit behaviors among dies, causing inconsistent power consumption and performance in replicated modules within integrated circuits, which existing technologies fail to efficiently manage.
Innovation Solution
A power manager dynamically adjusts power budgets and operating parameters for modules with different circuit behaviors by categorizing dies into bins based on manufacturing variations, allowing separate power domains and operating parameters to balance performance and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If replicated semiconductor dies are used in integrated circuits, then manufacturing cost and productivity are improved, but performance inconsistency and power consumption variation occur due to manufacturing variations
Solution Approach 1:
The patent segments the integrated circuit into multiple power domains, where each power domain groups replicated semiconductor dies with similar circuit behaviors. The power manager separately controls power allocation to each domain, allowing performance optimization for each group while maintaining overall system productivity. This segmentation resolves the contradiction by enabling differentiated management of replicated dies without requiring uniform high-performance selection.
Solution Approach 2:
The power manager dynamically adjusts power consumption parameters (voltage, frequency, power state) for each power domain based on the circuit behavior characteristics of the semiconductor dies within that domain. By changing operational parameters rather than hardware configuration, the system achieves performance consistency across replicated dies while maintaining manufacturing efficiency.
2Adaptability or versatility
If semiconductor dies with different circuit behaviors are placed in different performance bins, then manufacturing flexibility is improved, but power consumption management complexity increases in replicated modules
Solution Approach 1:
The patent segments replicated semiconductor dies into distinct power domains based on their circuit behavior characteristics. Each power domain is independently managed by the power manager, which allocates power and adjusts operational parameters specific to each domain. This segmentation simplifies power management complexity by creating modular, independent control units rather than requiring centralized complex management of all replicated dies.
Solution Approach 2:
Each power domain operates with semi-autonomous power management, where the power manager monitors circuit behavior and automatically adjusts power parameters for that specific domain without requiring complex cross-domain coordination. This self-service approach reduces overall power management complexity while maintaining adaptability to manufacturing variations.
3Reliability
If separate power domains are implemented for replicated modules, then performance balance is improved, but device complexity and control overhead increase
Solution Approach 1:
The power manager serves multiple functions across different power domains: it monitors circuit behavior, determines performance characteristics, allocates power budgets, and adjusts operational parameters. This universal control mechanism achieves performance balance across replicated modules through a single multi-functional component rather than requiring separate control structures for each domain, thereby reducing overall device complexity.
Solution Approach 2:
The power manager achieves performance balance by dynamically changing operational parameters (power state, voltage, frequency) for each power domain based on monitored circuit behavior. This parameter-based control approach is simpler than structural modifications, as it achieves performance balance through software/firmware control rather than hardware complexity.
Data Source
AI summary
An apparatus and method for efficiently managing performance among replicated modules of an integrated circuit despite manufacturing variations across semiconductor dies. An integrated circuit includes a first module with a first partition of multiple dies that share at least a same first power rail. The integrated circuit also includes a second module with a second partition of multiple dies that share at least a same second power rail different from the first power rail. The dies within partitions have differences in circuit parameters within a threshold such that the dies can be placed in a same first bin. The dies in different partitions belong to different bins. A power manager initially assigns the same operating parameters to the first partition and the second partition, but adjusts the operating parameters based on detection of the different circuit behavior due to manufacturing variations between the first partition and the second partition.