Chiplet Protocol Switch Die for Cross-Protocol Interconnects
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Solution Overview
Problem
As semiconductor devices become more complex and smaller in size, the challenge of effective chiplet-to-chiplet communication arises due to incompatibility of communication protocols used by different chiplets, necessitating a solution for protocol conversion to enable interoperability and high-speed communication.
Innovation Solution
A bonded structure comprising a carrier with a protocol switch die that converts communication signals from one protocol to another, directly bonded to chiplets without an intervening adhesive, facilitating communication between chiplets with different protocols through processing circuitry and multiplexing capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different chiplets use different communication protocols to maintain design independence and manufacturing flexibility, then device complexity and adaptability increase, but interoperability and communication compatibility deteriorate
Solution Approach 1:
A protocol switch die is introduced as an intermediary component between chiplets using different communication protocols. The protocol switch die receives signals from a first chiplet using a first communication protocol, converts the signal format, and transmits to a second chiplet using a second communication protocol. This intermediary enables interoperability between chiplets with incompatible protocols without requiring changes to the chiplets themselves, thus maintaining their design independence while achieving system-level compatibility.
2Adaptability or versatility
If protocol conversion is implemented to enable communication between chiplets with different protocols, then interoperability improves, but device complexity and signal processing requirements increase
Solution Approach 1:
The protocol conversion functionality is segmented into a separate protocol switch die, distinct from the functional chiplets. This segmentation allows each chiplet to focus on its primary function while the protocol switch die handles the complexity of protocol conversion. The protocol switch die contains dedicated circuitry for receiving, converting, and transmitting signals between different protocols, thereby isolating the signal processing complexity from the chiplets themselves.
3Reliability
If direct bonding is used to connect chiplets without adhesive to reduce manufacturing complexity and improve reliability, then manufacturing precision and reliability improve, but manufacturing process difficulty increases
Solution Approach 1:
The bonding process utilizes self-alignment and self-bonding mechanisms where the chiplets and protocol switch die are directly bonded to the carrier substrate without requiring adhesive materials. The direct bonding process relies on precise alignment and inherent bonding properties of the materials at the bonding interface, eliminating the need for separate adhesive application and curing steps. This self-service approach reduces manufacturing complexity and improves bonding reliability by removing potential failure points associated with adhesive layers.
Data Source
AI summary
A bonded structure is disclosed. The bonded structure can include a carrier. The bonded structure can include a first die having a first communications circuitry to format a communication signal according to a first communication protocol and to transmit the communication signal. The bonded structure can also include a protocol switch die having circuitry to receive the communications signal and to convert the communication signal from the first communication protocol to a second communication protocol, wherein the second communication protocol is different from the first communication protocol. The protocol switch die can transmit the communication signal according to the second communication protocol. The bonded structure can also include a second die having a second communications circuitry to receive the communication signal formatted in the second communication protocol.