Chiplet Throttle Level Bus for Dynamic Power and Thermal Management

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Chiplet-based systems face limitations in power and thermal management, which restrict their performance in varying electrical supply rail and thermal cooling environments, potentially reducing performance in intensive applications.

Innovation Solution

A chiplet system architecture with a throttle level bus and throttling logic circuitry that adjusts chiplet operation based on thermal and power excursions, using a throttle level bus to communicate throttle information among chiplets, allowing them to operate within safe thermal and power limits while maximizing performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If chiplet systems operate at maximum performance, then processing speed and computational capability are improved, but power consumption and thermal generation increase beyond safe limits

Engineering Contradiction:
Improveprocessing performanceVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSPower

Solution Approach 1:

The patent implements dynamic power management by making the chiplet system's operational state changeable based on real-time conditions. The throttle level bus and throttling logic circuitry enable the system to transition between different performance states (full performance, throttled performance) according to power and thermal conditions, resolving the contradiction between maintaining high productivity and controlling power consumption.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent establishes a feedback mechanism where power consumption and thermal conditions are monitored, and this information is used to adjust the operational state of chiplets through the throttle level bus. The throttling logic receives feedback about power/thermal excursions and dynamically adjusts chiplet operation to maintain safe limits while maximizing performance when conditions permit.

Inventive Principle:
Principle #23Feedback

2Productivity

If chiplet systems operate at maximum performance, then processing speed is improved, but thermal generation exceeds cooling capabilities

Engineering Contradiction:
Improveprocessing speedVSAvoidthermal generation
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The system dynamically adjusts its thermal state by transitioning between full-performance mode and throttled mode based on real-time thermal monitoring. When thermal generation exceeds cooling capabilities, the throttle level bus signals chiplets to reduce operation, thereby dynamically controlling temperature while maintaining high speed when thermal conditions allow.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

A thermal feedback loop is implemented where temperature sensors monitor thermal generation, and this information feeds back to the throttling logic which adjusts chiplet operation accordingly. This closed-loop control ensures thermal generation remains within cooling capabilities while maximizing processing speed when safe.

Inventive Principle:
Principle #23Feedback

3Reliability

If power and thermal limits are strictly enforced, then system reliability is improved, but performance in intensive applications is reduced

Engineering Contradiction:
Improvesystem reliabilityVSAvoidapplication performance
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

Rather than enforcing static power and thermal limits, the system uses dynamic throttling that adjusts operational constraints in real-time based on actual conditions. This allows the system to maintain high reliability by preventing excursions beyond safe limits while maximizing performance during intensive applications when conditions permit, resolving the contradiction between reliability and performance.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the operational parameters of chiplets dynamically by adjusting throttle levels based on real-time power and thermal measurements. This parameter adjustment allows the system to operate at high performance when conditions allow while maintaining reliability by reducing parameters (throttle level) when limits are approached, rather than enforcing fixed conservative limits.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11722138B2Dynamic power and thermal loading in a chiplet-based system
Publication Date: 2023.08.08 MICRON TECHNOLOGY INC
  • US11722138B2 patent drawing
  • US11722138B2 patent drawing
  • US11722138B2 patent drawing

AI summary

A chiplet system comprises an interposer including interconnect and multiple chiplets arranged on the interposer and interconnected using the interconnect of the interposer. The multiple chiplets include a throttle level bus source chiplet including a throttle level bus drive interface configured to place a throttle level value onto the throttle level bus, and one or more throttle level bus receiver chiplets operatively coupled to the throttle level bus. Each chiplet of the multiple chiplets includes throttling logic circuitry configured to set a throttle level of a chiplet according to the throttle level value.