Chiplets With Wicking Posts For Adhesive Interconnection
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Solution Overview
Problem
Existing methods for electrically interconnecting small integrated circuits, such as micro-transfer printed chiplets, to destination substrates are costly and complex, often requiring multiple manufacturing steps and facing challenges with topographical differences between the chiplets and the substrate.
Innovation Solution
The use of printable components with conductive connection posts and non-conductive wicking posts that protrude from the component substrate, allowing for efficient electrical connection to destination substrate contact pads through a curable adhesive layer, which also provides mechanical support and reduces manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional methods are used to electrically interconnect chiplets to backplanes, then electrical connection is achieved, but the process is costly and complex requiring multiple manufacturing steps
Solution Approach 1:
The patent combines multiple functions into the adhesive layer: it serves as both the bonding agent for mechanical attachment and as the electrical conductor for signal transmission. This eliminates the need for separate conductive materials and reduces the number of manufacturing steps required to achieve both mechanical and electrical interconnection of chiplets to backplanes.
Solution Approach 2:
The adhesive layer is designed to perform multiple functions simultaneously: mechanical bonding, electrical conduction, and potentially signal routing. This multi-functional approach simplifies the overall interconnection structure and reduces manufacturing complexity while maintaining reliable electrical connections.
2Reliability
If traditional interconnection methods are used, then electrical connection is established, but material waste and increased costs occur
Solution Approach 1:
The patent eliminates the need for separate conductive materials by using the adhesive layer for both bonding and conduction. This discards the traditional approach of using additional conductive materials that would be wasted during manufacturing and assembly, thereby reducing material waste and associated costs.
Solution Approach 2:
By making the adhesive layer electrically conductive, it serves dual purposes of mechanical bonding and electrical conduction, eliminating the need for separate conductive materials and reducing overall material consumption and waste.
3Ease of manufacture
If chiplets are placed on substrates with topographical differences, then electrical connection is attempted, but alignment precision and connection reliability deteriorate
Solution Approach 1:
The conductive adhesive layer acts as an intermediary that compensates for topographical differences between chiplets and backplanes. It provides a compliant bonding interface that can accommodate height variations and surface irregularities, ensuring reliable electrical and mechanical connection even when perfect flatness is not achieved.
Solution Approach 2:
The adhesive layer's material properties (viscosity, curing characteristics, compliance) are optimized to accommodate topographical variations. By controlling these parameters, the system can achieve reliable connections across surfaces with varying topography without compromising alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables robust, efficient, and cost-effective electrical interconnection of small integrated circuits to large destination substrates with fewer process steps, improving adhesion and reducing the risk of electrical faults and material waste.
Implementation Method 1
the other posts being non-conductive and configured to promote adhesion of the curable adhesive material to the component substrate
Data Source
AI summary
A printable component includes a component substrate and one or more electrical conductors. One or more electrically conductive connection posts protrudes from the component substrate to form an exposed electrical contact. Each connection post is electrically connected to at least one of the electrical conductors and one or more wicking posts protrude from the component substrate. The wicking post can be insulating. In certain embodiments, a printable component source wafer comprises a source wafer, a plurality of sacrificial portions separated by anchor portions formed in a sacrificial layer of the source wafer, and a plurality of printable components. Each printable component is disposed over a corresponding sacrificial portion and connected to an anchor portion by a tether. A destination substrate structure comprises a destination substrate having one or more electrically conductive contact pads, an adhesive layer disposed on the destination substrate, and one or more printable components.