Chiral-Reentrant Metamaterial for Compressive and Impact Resistance
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Solution Overview
Problem
Existing electronic devices suffer from insufficient shock absorbance and impact resistance due to the use of sealants and micro screws in their assembly, necessitating a more effective buffer layer to disperse stress and absorb shocks.
Innovation Solution
A mechanical metamaterial with high compressibility is developed using a combination of six-bonded chiral and four annular reentrant structures, integrated with elastic photocurable resin and surface-modified carbon nanotubes, fabricated via 3D printing to enhance shock and impact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealants and micro screws are used for fixation in assembly, then the electronic device can be manufactured and assembled, but the shock absorbance and shock-resistant capabilities are insufficient
Solution Approach 1:
The patent changes the physical and mechanical parameters of the buffer layer by using a foam material with specific density (0.03-0.08 g/cm³) and elastic modulus (0.1-0.5 MPa), transforming it from a rigid assembly method to a compliant shock-absorbing structure that maintains reliability while improving ease of manufacture
Solution Approach 2:
The patent employs a composite buffer layer combining foam material with adhesive layers, creating a multi-layer composite structure that integrates both shock absorption functionality and assembly fixation, thereby resolving the contradiction between shock resistance and ease of manufacture
2Reliability
If adhesive is applied as sealant to serve as shock buffer, then the assembly is sealed and fixed, but the shock absorbance capability is insufficient
Solution Approach 1:
The patent transforms the buffer structure by changing the material parameters from conventional adhesive to foam material with optimized density and elastic modulus, achieving superior shock absorbance without increasing device complexity since the foam material itself provides both buffering and sealing functions
Solution Approach 2:
The foam buffer layer serves multiple functions simultaneously: shock absorption, sealing, and structural support, eliminating the need for separate components and thereby improving shock absorbance while maintaining simple device structure
3Weight of moving object
If miniaturization is pursued to improve portability, then the electronic device becomes lighter and thinner, but the shock absorbance or impact resistance is reduced
Solution Approach 1:
The patent uses foam material with extremely low density (0.03-0.08 g/cm³) to create a lightweight buffer layer that provides high impact resistance despite the device's miniaturized size, effectively decoupling weight reduction from shock resistance degradation
Solution Approach 2:
The patent employs porous foam material that provides high shock absorption capability per unit weight, allowing the miniaturized device to maintain excellent impact resistance while keeping the buffer layer weight minimal, thus resolving the contradiction between lightweight design and shock resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metamaterial efficiently disperses and absorbs external impacts, reducing component deformation and enhancing mechanical durability, offering improved shock resistance and compressive response.
Implementation Method 1
the first structure units include six-bonded chiral structures; the second structure units include four annular reentrant structures
Implementation Method 2
the mechanical metamaterial comprises elastic photocurable resin and carbon nanotubes (CNTs) modified with surface functional groups
Data Source
AI summary
A mechanical metamaterial comprising a chiral structure and a reentrant structure repeatedly layered to form a 3D structure with improved compressive response is disclosed. The 3D structure of the present invention is a metamaterial which can be perfectly and easily produced by a photocuring 3D printing process without any internal support. The introduction of modified carbon nanotubes into the printing composite material improves the compression resistance and impact resistance of the products and increases the service life through the special periodic structure. The application of 3D printing technology in fabricating mechanical metamaterials can break through the processing limitation of traditional processing technology or microelectronics manufacturing technology to make three-dimensional periodic structures.