Multilayer Common-Mode Choke Coil Crossing Layout for High Frequencies
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Solution Overview
Problem
Current multilayer common-mode choke coils face challenges in transmitting differential-mode signals effectively at higher frequencies (such as 25 GHz to 30 GHz) and suppressing common-mode noise components, due to significant stray capacitance between coils.
Innovation Solution
The design incorporates a multilayer body with non-conductor layers and two coils where the first coil conductor and second coil conductor have no overlapping portions except where they cross, reducing stray capacitance and improving high-frequency characteristics by optimizing the distance and line width between coil conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the first coil conductor and second coil conductor are arranged in a multilayer common-mode choke coil, then the coil can transmit differential-mode signals and suppress common-mode noise, but stray capacitance between the coils increases, degrading high-frequency characteristics
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional multilayer stacked configuration. The first and second coil conductors are positioned on different layers (first interface and second interface between non-conductor layers), allowing them to cross without overlapping in the planar view. This spatial separation in the vertical dimension reduces parasitic capacitance while maintaining the common-mode noise suppression function.
Solution Approach 2:
The coil structure is divided into distinct segments: first coil conductor on first interface, second coil conductor on second interface, separated by non-conductor layers. This segmentation allows independent optimization of each coil's position and reduces unwanted electromagnetic coupling between them, particularly reducing stray capacitance at high frequencies.
2Volume of moving object
If conventional multilayer common-mode choke coil designs are used, then the structure can be compact, but high-frequency signal transmission above 30 GHz is degraded due to significant stray capacitance
Solution Approach 1:
By utilizing the vertical dimension through multilayer stacking, the patent achieves compact planar footprint while maintaining low stray capacitance. The coil conductors are separated in the vertical direction (different interfaces between non-conductor layers), allowing high-frequency signal transmission above 30 GHz without significant capacitance degradation, thus resolving the contradiction between compact size and high-frequency performance.
3Reliability
If the first coil conductor and second coil conductor overlap each other in planar view, then the common-mode noise suppression is improved, but the stray capacitance increases significantly
Solution Approach 1:
The patent resolves this contradiction by using the vertical dimension to separate the coil conductors. The first coil conductor is disposed on the first interface and the second coil conductor on the second interface between non-conductor layers, allowing them to cross without overlapping when viewed in plan. This maintains effective common-mode noise suppression through proper coil geometry while minimizing stray capacitance by eliminating parallel overlapping areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the high-frequency characteristics of the common-mode choke coil, allowing for effective transmission of differential-mode signals and suppression of common-mode noise components at frequencies above 30 GHz.
Implementation Method 1
a first coil (11) and a second coil (12) which are incorporated in the multilayer body (2)
Implementation Method 2
The plurality of non-conductor layers include a first plurality of non-conductor layers and a second plurality of non-conductor layers
Data Source
AI summary
A common-mode choke coil includes a multilayer body, a first coil, and a second coil. The multilayer body includes plural stacked non-conductor layers. The first and second coils are incorporated in the multilayer body. The first coil includes a first coil conductor. The second coil includes a second coil conductor disposed along an interface between non-conductor layers different from an interface between non-conductor layers along which the first coil conductor is disposed. With the first coil conductor and the second coil conductor being viewed in plan in the stacking direction of the multilayer body, the first coil conductor and the second coil conductor have no portion where the two coil conductors overlap each other, except for a portion where the two coil conductors cross each other.