Integrated Choke Probe Needles for RF-Suppressed Wafer Biasing
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Solution Overview
Problem
Existing wafer probing technologies face issues with RF signal reflections during DC probing tests, leading to degraded testing performance and the need for additional die packaging, which prolongs the design cycle and increases costs.
Innovation Solution
Integration of inductive probing needles with choke inductors in the probe wedge or probe card to suppress RF signals, allowing efficient DC current flow for improved wafer biasing and reduced interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional probing needles are used for DC probing tests, then the testing process is simple, but RF signal reflections occur causing degraded testing performance
Solution Approach 1:
The patent combines the probing needle with a choke inductor into a single integrated structure. The choke inductor is directly formed on the probing needle shaft, merging the electrical connection function with the RF signal suppression function into one component, thereby eliminating RF signal reflections while maintaining testing reliability without requiring separate suppression components
Solution Approach 2:
The choke inductor acts as an intermediary element between the probing needle and the device under test. It mediates the electrical connection while simultaneously suppressing RF signal reflections through its inductive impedance, allowing DC probing signals to pass while blocking reflected RF signals
2Reliability
If die packaging is used to eliminate RF interference, then RF signal reflection is suppressed, but the design cycle is prolonged and costs increase
Solution Approach 1:
The RF signal suppression capability is built into the probe structure itself before the wafer probing process begins. The choke inductor is pre-integrated on the probing needle, providing RF suppression at the source rather than requiring post-processing packaging steps, thereby eliminating delays in the design cycle
Solution Approach 2:
The patent extracts the RF signal suppression function from the die packaging process and relocates it to the probe structure. By taking out this function and implementing it on the probing needle itself, the need for additional die packaging steps is eliminated, reducing both time and cost
3Measurement precision
If conventional probes are used for biasing active devices, then the setup is simple, but RF signal interference affects DC probing accuracy
Solution Approach 1:
The patent converts the potentially harmful RF signal reflections into a beneficial effect by using the choke inductor to create high impedance at RF frequencies. This transforms the RF interference problem into a solution where the same inductive structure that could potentially resonate now provides RF signal suppression, improving DC probing accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances DC probing accuracy by minimizing RF signal interference, eliminating the need for die packaging, and reducing testing costs and cycle time.
Implementation Method 1
a probe wedge or probe card having probing needles integrated with choke inductor for direct current (DC) bias
Data Source
AI summary
The proposed probe wedge or probe card is configured to be used for a wafer probe system to enhance the test process more efficiently. The probe wedge or probe card includes one or more inductive probing needles and one or more conductive probing needles. Each inductive probing needle includes a shaft and a choke inductor integrated with the shaft. The shaft includes a first end section, a second end section, and an intermediate section between the first and second end sections. The first and second end sections are made of an electrically conductive material and the intermediate section is made of an electrically non-conductive material. The choke inductor includes a first terminal connected to the first end section of the shaft and a second terminal connected to the second end section of the shaft.