Chromatic Confocal Probe Mark Analysis
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Solution Overview
Problem
The introduction of low-K dielectric materials in integrated circuits poses challenges in probe mark inspection due to their softer or more brittle nature, leading to damage and deformation, which affects circuit functionality, and existing measurement methods are costly, slow, and lack accuracy.
Innovation Solution
A chromatic confocal system with multiple sensors and a processor is used to scan probe marks with sub-micron axial resolution, enabling high-throughput and accurate evaluation of probe mark characteristics, and a triangulation system with incoherent light illumination provides sub-micron axial resolution for precise depth measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional chromatic confocal systems are used for probe mark depth measurement, then measurement capability is provided, but measurement speed is very slow and axial accuracy is limited
Solution Approach 1:
The patent divides the measurement function into multiple independent sensors, each responsible for a specific depth range or spatial region. This segmentation allows parallel processing of multiple measurement points simultaneously, thereby increasing measurement speed while maintaining the sub-micron axial resolution provided by each individual sensor
Solution Approach 2:
The patent transitions from single-point sequential measurement to multi-point parallel measurement by introducing multiple sensors arranged in specific spatial configurations. This dimensional expansion enables simultaneous acquisition of depth information across multiple locations, resolving the speed-accuracy tradeoff
2Measurement precision
If atomic force microscope or focused ion beam cross sectioning is used for probe mark depth measurement, then highly accurate measurements are achieved, but the process is very costly and very slow
Solution Approach 1:
The patent replaces mechanical measurement methods (atomic force microscopy, focused ion beam cross-sectioning) with optical-based chromatic confocal sensing. This substitution eliminates the need for physical contact or sample destruction while achieving comparable or superior measurement accuracy, thereby dramatically reducing measurement time and cost
3Speed
If low-K dielectric materials are used in integrated circuits, then higher circuit speed and smaller feature sizes are enabled, but the low-K film is more easily damaged or deformed by probe contact
Solution Approach 1:
The patent performs non-contact or minimal-contact optical characterization of the low-K dielectric film properties before probe contact. By pre-mapping the film's mechanical characteristics using chromatic confocal sensing, the system can identify vulnerable areas and adjust probe parameters accordingly, preventing damage while enabling the high-speed performance benefits of low-K materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a highly accurate and efficient method for evaluating probe marks, reducing the risk of damage and improving circuit reliability by offering sub-micron axial resolution and high throughput, addressing the limitations of existing methods.
Implementation Method 1
scanning the probe mark by multiple spots; and evaluating a probe mark characteristic in response to detection signals generated by multiple sensors of the chromatic confocal system that is characterized by a sub-micron axial resolution
Implementation Method 2
a triangulation system with incoherent light illumination provides sub-micron axial resolution for precise depth measurements
Data Source
AI summary
A method for analyzing probe mark, the method includes: scanning the probe mark by multiple spots; evaluating a probe mark characteristic in response to detection signals generated by multiple sensors of the chromatic confocal system that is characterized by a sub-micron axial resolution.


