Semiconductor Chuck Solid-State Bonding for Hermetic Heater Integration
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Solution Overview
Problem
Ceramic pedestals and chucks used in semiconductor manufacturing face challenges in withstanding harsh chemical environments and maintaining the integrity of embedded components like heaters, clamping electrodes, and RF antennas during processing and cleaning.
Innovation Solution
A layered assembly is developed using ceramic substrates with embedded electrically functioning layers, such as resistive heaters and RF antennas, secured together by a solid-state bonding process with nickel-based materials, including peripheral sealing bands to ensure hermetic sealing and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic pedestals are used to withstand harsh chemical environments and high temperatures, then reliability is improved, but manufacturing complexity increases due to the need for embedded components and hermetic sealing
Solution Approach 1:
The pedestal is divided into multiple ceramic substrates that can be separately manufactured and then bonded together. This segmentation allows each substrate to be optimized for specific functions (heater, RF antenna, clamping electrode) while maintaining the overall reliability needed for harsh environments, and simplifies manufacturing by enabling modular assembly
Solution Approach 2:
The invention uses composite structures combining ceramic substrates with metallic bonding layers (nickel, copper, or nickel-copper alloys). This composite approach provides both the chemical/thermal resistance of ceramics and the electrical conductivity and bonding capability of metals, achieving reliability while managing manufacturing complexity through material selection
2Adaptability or versatility
If embedded components (heaters, clamping electrodes, RF antennas) are integrated into ceramic pedestals, then functionality is improved, but maintaining integrity under harsh processing conditions becomes more difficult
Solution Approach 1:
The invention merges the ceramic substrate with metallic bonding layers and embedded components into a single integrated structure through solid-state bonding. This combining ensures that the heater, RF antenna, and clamping electrode become integral parts of the ceramic pedestal, maintaining integrity under harsh processing conditions while preserving all required functionalities
Solution Approach 2:
The bonding process parameters (temperature, pressure, atmosphere) are carefully controlled and changed in a specific sequence to achieve proper bonding without damaging embedded components. The use of intermediate metallic layers with specific melting points and bonding characteristics allows parameter optimization for both component integrity and bonding strength
3Reliability
If solid-state bonding process is used to secure substrates together, then hermetic sealing is achieved, but manufacturing process complexity increases
Solution Approach 1:
Metallic bonding layers are deposited on ceramic substrates before assembly using techniques like sputtering or electroplating. This preliminary action prepares the surfaces for bonding and ensures proper metallurgical bonding when substrates are joined, achieving hermetic sealing while standardizing the process to reduce manufacturing complexity
Solution Approach 2:
Intermediate metallic bonding layers (nickel, copper, or nickel-copper alloys) are introduced between ceramic substrates to facilitate bonding. These intermediary layers act as mediators that bond well to both ceramic and metal components, enabling hermetic sealing through a controlled multi-layer structure that simplifies the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively secures and seals the substrates, maintaining the functionality of embedded components under harsh conditions, achieving a hermetic seal with low leak rates and compatibility with high-temperature operations.
Implementation Method 1
the material being patterned as an electrically functioning layer and with integral electrical termination areas and a peripheral sealing band disposed around a periphery of the at least one face of the two adjacent substrates, and joining the plurality of substrates with heat and pressure in a controlled environment such that the material is solid-state bonded to the two adjacent substrates
Implementation Method 2
the electrically functioning layer is a resistive heater and a temperature sensor
Data Source
AI summary
A layered assembly for use in a controlled atmosphere chamber includes a plurality of substrates and an electrically functioning layer embedded between two adjacent substrates of the plurality of substrates, the electrically functioning layer being a material configured to secure the two adjacent substrates together using a solid-state bonding process. An electrical termination area is integral with the electrically functioning layer, and a peripheral sealing band is embedded between and extends around a periphery of internal faces of the two adjacent substrates, the peripheral sealing band being a material configured to secure and seal the two adjacent substrates together using the solid-state bonding process. Dielectric regions are present between the two adjacent substrates and between edge boundaries of the electrically functioning layer, the dielectric regions being sealed between the two adjacent substrates by the peripheral sealing band.