Semiconductor Chuck Insulating Tube Bonding for Thermal Uniformity
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Solution Overview
Problem
In semiconductor manufacturing apparatus, the length of a resin member between the insulating tube and the base plate through-hole cannot be controlled, leading to temperature variations above the base plate through-hole.
Innovation Solution
A member for semiconductor manufacturing apparatus is designed with a ceramic plate, a base plate, an insulating tube, and an adhesive agent pool. The adhesive layer forms from the ceramic plate to an intermediate point of the adhesive agent pool, controlling the length of the adhesive layer and reducing temperature variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin member is provided between the insulating tube and the base plate through-hole, then thermal stress is reduced, but the length of the resin member cannot be controlled, causing temperature variation
Solution Approach 1:
The invention changes the physical state of the adhesive agent from a solid resin member to a liquid/adhesive form that can be precisely controlled during application. By controlling the amount and distribution of the adhesive agent, the length of the adhesive layer is precisely controlled, thereby controlling the temperature in the area above the base plate through-hole while maintaining thermal stress reduction benefits.
Solution Approach 2:
The invention applies the adhesive agent in advance in a controlled manner before final assembly. The adhesive agent is applied to the insulating tube or base plate through-hole in a specific amount and distribution pattern, ensuring that the adhesive layer length is controlled from the beginning, which prevents temperature variation issues.
2Stability of the object's composition
If the insulating tube is fixed to the base plate through-hole, then structural stability is improved, but thermal uniformity above the through-hole deteriorates
Solution Approach 1:
The invention applies the adhesive agent locally in a controlled manner, creating an adhesive layer with specific length and distribution. This localized control allows the adhesive layer to provide structural bonding while managing thermal characteristics in the specific area above the base plate through-hole, achieving both structural stability and thermal uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The controlled length of the adhesive layer reduces temperature variations above the base plate through-hole, improving thermal uniformity and consistency in semiconductor manufacturing.
Implementation Method 1
an adhesive layer including an insulating tube outer circumferential surface adhesion part formed from the lower surface of the ceramic plate to an intermediate point of the adhesive agent pool, and configured to bond the inner circumferential surface of the base plate through-hole and the outer circumferential surface of the insulating tube together
Data Source
AI summary
A member for semiconductor manufacturing apparatus includes: a ceramic plate having a wafer placement surface on its upper surface and a built-in electrode; a base plate provided on a lower surface of the ceramic plate; a base plate through-hole that penetrates the base plate in an up-down direction; an insulating tube inserted into the base plate through-hole; an adhesive agent pool provided in at least one of an inner circumferential surface of the base plate through-hole or an outer circumferential surface of the insulating tube, and disposed at a position down away from an upper surface of the insulating tube; and an adhesive layer including an insulating tube outer circumferential surface adhesion part formed from the lower surface of the ceramic plate to an intermediate point of the adhesive agent pool.