Electrostatic Chuck Bypass Spacing for Uniform Wafer Heating
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Solution Overview
Problem
Existing electrostatic chucks face issues with thermal uniformity due to heat generation by the bypass part, leading to deviations in the temperature of the wafer placement surface, especially with increased zones for finer temperature control.
Innovation Solution
The electrostatic chuck design includes a bypass part positioned lower than the substrate lower surface, with a distance between the heater lower surface and bypass upper surface greater than the distance between the heater upper surface and the substrate upper surface, ensuring the bypass part is sufficiently distant from the placement surface, thereby reducing the heat impact on temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the bypass part is positioned closer to the heater part to reduce heat generation, then the power supply efficiency is improved, but the heat impact on the placement surface increases causing temperature deviation
Solution Approach 1:
The bypass part is positioned in the vertical dimension (lower than the substrate lower surface) rather than in the horizontal plane, creating spatial separation that reduces thermal coupling while maintaining electrical connection efficiency
2Measurement precision
If the number of heater zones is increased to improve temperature control precision, then the in-plane temperature distribution control is improved, but the heat generation by conduction parts increases
Solution Approach 1:
The heater is divided into multiple independent zones with separate power supply paths, allowing independent control of each zone's temperature while distributing the power supply load to reduce concentrated heat generation
Solution Approach 2:
The bypass part is positioned in the vertical dimension below the substrate, separating the power supply path from the heater zones in space, which reduces thermal interference while maintaining electrical connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the heat influence on the placement surface, maintaining thermal uniformity and improving temperature control, particularly in regions with high zone density.
Implementation Method 1
The heater part includes at least one heater layer. The heater part heats the ceramic dielectric substrate.
Implementation Method 2
the electrostatic chuck applies power for electrostatic clamping to an embedded electrode and clamps a substrate such as a silicon wafer or the like by an electrostatic force.
Data Source
AI summary
An electrostatic chuck includes a ceramic dielectric substrate, a base plate, a heater part, and a bypass part. The ceramic dielectric substrate includes a substrate upper surface and a substrate lower surface. The heater part is disposed between the substrate upper surface and the substrate lower surface. The heater part includes at least one heater layer. The heater part includes a heater upper surface and a heater lower surface. The bypass part includes a first bypass portion disposed lower than the substrate lower surface. The first bypass portion including a first bypass upper surface and a first bypass lower surface. A second distance between the heater lower surface and the first bypass upper surface is greater than a first distance between the heater upper surface and the substrate upper surface.