Chuck Clamp Interlock for Semiconductor Handler
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Solution Overview
Problem
Manual replacement of the stop plate in thermal control pick and place handlers for semiconductor device testing is prone to mishandling and operator error, leading to device package damage due to convex warping or bending during testing.
Innovation Solution
A chuck apparatus with a clip and cam mechanism that automatically inhibits device pickup when the stop plate is not installed, utilizing springs and pivot axes to secure the device under test, ensuring proper engagement and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual replacement of stop plate is used, then operator flexibility is maintained, but device package damage occurs due to mishandling or operator error
Solution Approach 1:
The chuck apparatus automatically detects whether the stop plate is installed and autonomously prevents carrier pickup when the stop plate is missing. The system uses sensors to monitor stop plate presence and automatically controls the chuck engagement state, eliminating the need for manual verification by operators and preventing human error导致的device damage
Solution Approach 2:
The system incorporates sensors that continuously monitor the presence and proper installation of the stop plate. This feedback mechanism provides real-time information to the control system, which then automatically adjusts the chuck's pickup capability accordingly, ensuring device protection without requiring manual intervention
2Productivity
If stop plate is not installed, then device pickup can proceed, but convex warping or bending of device occurs causing package crack
Solution Approach 1:
The system proactively prevents the harmful condition by automatically blocking the carrier pickup function when the stop plate is not properly installed. The sensor-detection and automatic-chuck-control mechanism acts before the pickup operation can occur, eliminating the risk of device warping and cracking that would result from proceeding without the stop plate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents device package damage by ensuring the stop plate is correctly installed before device pickup, maintaining the integrity of the semiconductor package during testing.
Implementation Method 1
A first spring is connected between the base and the cam to bias the cam toward the first cam position. A second spring is connected between the base and the clip to bias the clip toward the second clip position.
Data Source
AI summary
An apparatus includes a clip mounted to a base that pivots about a first pivot axis between a first position and a second position. An abutment surface of the clip is spaced from a path of a carrier structure when the clip is in the first position. The abutment surface engages the carrier structure to secure the carrier structure and a device to the apparatus when the clip is in the second clip position. A cam includes a first surface that pivots the clip to the first clip position when the cam is in the first cam position. The cam includes a second surface that extends into an opening of the base when the cam is in a first position to allow a stop plate pin to engage the cam to rotate the cam from the first position to a second position when a stop plate is installed.