Electroplating Chuck Cleaning Chamber for Sn Residue Removal
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Solution Overview
Problem
Existing methods struggle to effectively remove electroplating residues, particularly Tin (Sn) or Tin-Silver (Sn/Ag) residues, from electroplating hardware, leading to contamination and degradation of electroplating equipment, especially on components with complex geometries.
Innovation Solution
A maintenance chamber with a positioning system and gas atomizing nozzles is used to rotate and spray atomized fluids, such as deionized water or cleaning chemistry, onto electroplating chucks to dislodge and remove contamination, utilizing optical sensors for cleanliness verification and high-velocity gas streams for drying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning methods (cloth or cleaning agent on end effector) are used, then the cleaning process is simple, but electroplating residues remain especially on components with complicated geometry
Solution Approach 1:
The patent employs gas atomizing nozzles that spray atomized cleaning fluid under pressure to effectively remove electroplating residues from complex geometries, seals, and electrical contacts. The hydraulic/pneumatic spray system penetrates intricate surfaces where conventional cloth cleaning fails, achieving reliable cleaning without mechanical contact.
Solution Approach 2:
The invention changes the physical state of the cleaning fluid from liquid to atomized spray, and controls parameters such as spray pressure, atomization gas flow rate, and fluid temperature. These parameter changes enable the cleaning fluid to effectively reach and remove residues from complex geometries while maintaining controllable cleaning intensity.
2Reliability
If multiple nozzles and positioning systems are added to improve cleaning coverage, then cleaning completeness improves, but device complexity increases
Solution Approach 1:
The positioning system serves multiple functions: it holds the electroplating chuck, rotates it for uniform cleaning exposure, and positions it relative to the spray nozzles. This multi-functionality reduces the need for separate mechanisms for each cleaning action, achieving comprehensive cleaning coverage while limiting overall system complexity growth.
Solution Approach 2:
The patent combines multiple nozzles into a single integrated spray system that can simultaneously clean multiple surfaces of the electroplating chuck. The positioning system integrates chuck holding, rotation, and positioning functions into one mechanism, reducing the number of separate components needed while achieving complete cleaning coverage.
3Reliability
If atomized fluid spray is used to effectively remove residues, then cleaning effectiveness improves, but fluid consumption and potential splash contamination increase
Solution Approach 1:
The atomization process changes the fluid delivery parameters by breaking liquid into fine droplets that cover larger surface areas with less total fluid volume. By controlling atomization gas flow rate and spray pressure, the system achieves effective residue removal while minimizing overall fluid consumption compared to conventional liquid spraying or wiping methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently reduces contamination on electroplating chucks, extending equipment life, minimizing chemical residue, and preventing cross-contamination of plating baths, while reducing operational costs.
Implementation Method 1
a gas atomizing nozzle, configured to spray an atomized fluid onto the electroplating chuck
Implementation Method 2
dislodging or eroding contaminants on the electroplating chuck by mechanical interactions between atomized liquid droplets and the contaminants
Implementation Method 3
a positioning system configured to rotate, axially move, or both rotate and axially move the electroplating chuck
Implementation Method 4
The high velocity stream of gas may be used to dry the electroplating chuck
Data Source
AI summary
A maintenance chamber configured to reduce contamination on an electroplating chuck, the maintenance chamber including a positioning system configured to rotate, axially move, or both rotate and axially move the electroplating chuck, and a gas atomizing nozzle, wherein the nozzle is configured to spray an atomized fluid onto the electroplating chuck, wherein the atomized fluid is configured to reduce contamination on the electroplating chuck. Further, a method for reducing contamination of an electroplating chuck inside a maintenance chamber, including placing the electroplating chuck inside the maintenance chamber, spraying the electroplating chuck with an atomized fluid from one or more nozzles, and dislodging or eroding contaminants on the electroplating chuck by mechanical interactions between atomized liquid droplets and the contaminants.