Electrostatic Chuck Contact Regions for Through-Hole Temperature Control
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Solution Overview
Problem
In plasma processing, temperature singularity occurs near the through-holes of electrostatic chucks, affecting the in-plane uniformity of substrate processing.
Innovation Solution
The electrostatic chuck design incorporates protrusions with varying densities around through-holes to enhance cooling capacity, specifically arranging a higher density of protrusions in the first substrate contact portion and a lower density in the second substrate contact portion to suppress temperature singularity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If through-holes are formed in the electrostatic chuck for substrate support, then substrate access and processing are enabled, but temperature singularity occurs near the through-holes affecting in-plane uniformity
Solution Approach 1:
The electrostatic chuck employs protrusions with spatially varying densities to create different local thermal properties. The first substrate contact portion has a higher protrusion density than the second substrate contact portion, providing enhanced cooling capacity specifically in regions prone to temperature singularity near through-holes, thereby achieving local temperature control while maintaining overall substrate access functionality
Solution Approach 2:
The invention changes the density parameter of protrusions across different regions of the electrostatic chuck. By varying the protrusion density from the first substrate contact portion to the second substrate contact portion, the thermal conductivity and cooling capacity are adjusted to compensate for temperature rises near through-holes, achieving uniform temperature distribution
2Temperature
If protrusions are added to enhance cooling capacity, then temperature uniformity improves, but device complexity increases
Solution Approach 1:
The electrostatic chuck surface is segmented into multiple substrate contact portions with different protrusion densities. The first substrate contact portion contains protrusions at a first density while the second substrate contact portion contains protrusions at a second density, allowing differentiated thermal management without requiring a completely redesign of the entire chuck structure
Solution Approach 2:
Rather than uniformly modifying the entire electrostatic chuck, the invention applies protrusions with varying densities only in specific substrate contact portions where temperature control is needed. This localized approach enhances cooling capacity where required while minimizing overall structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces local temperature rises near the through-holes, improving in-plane uniformity and preventing temperature singularity during plasma processing.
Implementation Method 1
protrusions that contact the substrate... enhance cooling capacity... suppress temperature singularity
Data Source
AI summary
An electrostatic chuck, includes: a central region configured to support a substrate; at least one through-hole formed in the central region; a first substrate contact portion arranged around the through-hole; and a second substrate contact portion arranged around the first substrate contact portion. The first substrate contact portion and the second substrate contact portion have protrusions protruding upward from the central region. The protrusions are arranged in the first substrate contact portion at a first density. The protrusions are arranged in the second substrate contact portion at a second density lower than the first density.