Electrostatic Chuck Cooling Base with Parallel Diffuser Paths
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Solution Overview
Problem
Traditional substrate supports in semiconductor manufacturing experience thermal non-uniformity due to serial cooling paths, leading to azimuthal thermal variations that cannot be adequately compensated by hardware adjustments.
Innovation Solution
A cooling assembly with a diffuser that creates parallel cooling paths to distribute cooling fluid evenly across the substrate support, reducing azimuthal non-uniformity and improving temperature control, which can be combined with independently controllable heating zones for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If serial cooling paths are used in traditional substrate supports, then the cooling structure is simple, but thermal non-uniformity and azimuthal thermal variations occur
Solution Approach 1:
The cooling base is segmented into multiple independent cooling channels (first cooling channel, second cooling channel, third cooling channel, fourth cooling channel) arranged in parallel. Each channel independently delivers cooling fluid to different regions of the substrate support, eliminating the thermal non-uniformity caused by serial cooling paths while maintaining structural simplicity.
2Temperature
If parallel cooling paths are implemented to improve thermal uniformity, then temperature distribution improves, but device complexity increases
Solution Approach 1:
Multiple cooling channels are merged into a single integrated cooling base structure. The first, second, third, and fourth cooling channels are all incorporated into one cooling base that contacts the substrate support, achieving parallel cooling without requiring separate cooling units. This reduces device complexity while maintaining thermal uniformity.
Solution Approach 2:
The cooling base serves multiple functions simultaneously: it provides thermal cooling through parallel channels, acts as a structural support for the substrate support, and distributes cooling fluid evenly across different regions. This multi-functionality eliminates the need for additional components, maintaining simplicity while improving thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces thermal non-uniformity, enabling a wider processing window under various conditions and minimizing thermally induced profile skews during substrate processing, thus improving the uniformity and efficiency of semiconductor processing.
Implementation Method 1
a cooling base having a first side for contacting the substrate support and providing cooling to the substrate support
Implementation Method 2
the diffuser defines a plurality of cooling paths for delivering a cooling fluid towards the cooling base in a parallel manner
Data Source
AI summary
Embodiments of the present disclosure generally provide apparatus and method for cooling a substrate support in a uniform manner. One embodiment of the present disclosure provides a cooling assembly for a substrate support. The cooling assembly includes a cooling base having a first side for contacting the substrate support and providing cooling to the substrate support, a diffuser disposed on a second side of the cooling base, wherein the diffuser defines a plurality of cooling paths for delivering a cooling fluid towards the cooling base in a parallel manner, and an inlet/outlet plate disposed under the diffuser, wherein the inlet/outlet plate is provides an interface between the diffuser and an inlet and outlet of a cooling fluid.