Electrostatic Chuck Fixing Structure for Uniform Cooling Gas Flow
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Solution Overview
Problem
The substrate fixing device in existing technologies experiences a decrease in temperature uniformity on the placement surface due to positional misalignment between the base plate and the electrostatic chuck, leading to non-uniform cooling gas flow rates and potential blockage of gas paths, which affects the etching process.
Innovation Solution
A substrate fixing device design that incorporates a base plate with first bottomed holes and an electrostatic chuck with corresponding second bottomed holes, secured by fixing pins to maintain precise alignment and uniform gas flow, thereby stabilizing the temperature uniformity on the placement surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a gas supply part is provided to cool the wafer through a gas flow path in the base plate and gas hole in the electrostatic chuck, then the wafer cooling function is improved, but the temperature uniformity of the placement surface decreases due to positional misalignment between the base plate and electrostatic chuck
Solution Approach 1:
The patent introduces a mediator structure consisting of protrusions on the base plate that fit into grooves on the electrostatic chuck. This intermediary mechanical coupling ensures precise positional alignment between the gas flow path in the base plate and the gas hole in the electrostatic chuck, preventing misalignment that would otherwise cause non-uniform cooling and temperature distribution on the wafer surface.
Solution Approach 2:
The alignment protrusions and grooves are pre-formed during manufacturing to establish precise positional relationships before assembly. This preliminary action ensures that when the base plate and electrostatic chuck are assembled, the gas flow path and gas hole are automatically aligned correctly, eliminating the need for post-assembly adjustment and ensuring uniform temperature distribution from the start.
2Reliability
If the electrostatic chuck is mounted on the base plate without fixing members, then the device complexity is reduced, but the positional alignment between base plate and electrostatic chuck becomes unstable
Solution Approach 1:
The patent employs fixing members with protrusions and grooves as an intermediary mechanical coupling system between the base plate and electrostatic chuck. This intermediary structure provides stable positional alignment and reliable fixation without requiring complex external fastening mechanisms, thereby improving reliability while maintaining relatively simple device complexity.
Solution Approach 2:
The alignment and fixation functions are merged into a single integrated structure where the protrusions on the base plate and grooves on the electrostatic chuck serve both to align the components positionally and to secure them mechanically. This merging of functions eliminates the need for separate alignment fixtures and fasteners, reducing overall device complexity while ensuring stable positional alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses temperature non-uniformity by maintaining precise alignment and gas flow uniformity, ensuring stable attachment of ring-shaped members and consistent thermal conductivity, thus enhancing the etching process.
Implementation Method 1
a substrate fixing device configured to suck and hold a wafer by an electrostatic chuck mounted on a base plate
Implementation Method 2
a gas supply part for cooling a wafer is provided. The gas supply part supplies a gas to a surface of the electrostatic chuck via a gas flow path provided in the base plate
Data Source
AI summary
A substrate fixing device includes a base plate having a first surface in which a plurality of first bottomed holes are formed, an electrostatic chuck mounted on the first surface of the base plate and having a second surface facing the first surface, the second surface being formed therein with a plurality of second bottomed holes each connected to each of the first bottomed holes, and a plurality of fixing members each fit into one first bottomed hole and one second bottomed hole.