Chuck Fluid Dispensing for In-Situ Chamber Decontamination
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Solution Overview
Problem
The complexity of semiconductor device manufacturing processes and the demand for low contamination levels are challenging, with manual cleaning procedures being time-consuming and disrupting the manufacturing process, leading to reduced throughput and yield.
Innovation Solution
A chuck-based device is integrated into the semiconductor manufacturing apparatus to perform in-situ cleaning by dispensing decontamination fluid through multiple openings, ensuring cleanliness without disrupting the vacuum or seals, thus maintaining manufacturing throughput and capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual cleaning procedures are used to reduce contamination levels, then cleanliness is improved, but manufacturing throughput is reduced due to process disruption and time consumption
Solution Approach 1:
The cleaning system enables the chamber to clean itself automatically through integrated fluid dispensing nozzles that deposit cleaning solutions and ultrasonic transducers that generate cavitation, eliminating the need for manual intervention and allowing continuous operation without throughput loss
Solution Approach 2:
The system performs cleaning operations in advance or during idle periods between manufacturing cycles by integrating cleaning functions into the chamber structure, so that contamination is removed before it affects product quality while maintaining manufacturing schedules
2Manufacturing precision
If manual cleaning procedures are used to reduce contamination levels, then cleanliness is improved, but time consumption increases leading to reduced yield
Solution Approach 1:
The chamber performs automatic self-cleaning through integrated fluid dispensing and ultrasonic cavitation systems, eliminating manual cleaning time and enabling continuous manufacturing operations without yield loss
Solution Approach 2:
Manual mechanical cleaning operations are replaced by automated ultrasonic cavitation and fluid dispensing systems that clean surfaces through acoustic energy and chemical action, dramatically reducing cleaning time while maintaining effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The chuck-based device effectively reduces contamination levels within the chamber, ensuring consistent high yield and performance of semiconductor devices by maintaining the integrity of the manufacturing process.
Implementation Method 1
A fluid delivery system having a first multiple of openings configured to dispense the fluid
Data Source
AI summary
The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber, a chuck housed in the chamber and configured to hold a substrate, and a control device configured to control a translational displacement and a rotation of the chuck. The chuck can include a passage extending along a periphery of the chuck and dividing the chuck into an inner portion and an outer sidewall portion, and a first multiple of openings through the outer sidewall portion of the chuck and interconnected with the passage. The passage can be configured to transport a fluid. The first multiple of openings can be configured to dispense the fluid.