Chuck Fluid Dispensing for In-Situ Semiconductor Chamber Cleaning
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Solution Overview
Problem
The increasing complexity of semiconductor device manufacturing processes and the demand for low contamination levels are hindered by the time-consuming nature of manual cleaning procedures, which disrupt the vacuum and throughput of semiconductor manufacturing systems.
Innovation Solution
A chuck-based device is integrated into the chamber of a semiconductor manufacturing apparatus, capable of dispensing decontamination fluid through multiple openings to clean the chamber surfaces in-situ, maintaining the vacuum and ensuring high manufacturing throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual cleaning procedures are used to reduce contamination levels, then contamination levels are reduced, but the vacuum is disrupted and throughput decreases
Solution Approach 1:
The cleaning system is activated during idle periods or between production batches, performing cleaning actions before the next manufacturing cycle begins. This allows contamination to be reduced without interrupting the continuous flow of production, as the cleaning occurs in advance rather than during active manufacturing.
Solution Approach 2:
A robotic manipulator with specialized end effectors serves as an intermediary between the cleaning agents and the chamber components. This automated intermediary can deliver cleaning solutions, perform mechanical cleaning actions, and remove contaminants without human operators needing to break the vacuum seal, thereby maintaining both low contamination levels and continuous throughput.
2Manufacturing precision
If manual cleaning procedures are used to reduce contamination levels, then contamination levels are reduced, but time is consumed and efficiency decreases
Solution Approach 1:
The cleaning system is designed to be self-contained and automated, with robotic manipulators that can autonomously navigate to target components, deliver cleaning agents through integrated dispensing systems, perform cleaning actions, and remove contaminants without requiring external intervention. This self-service capability eliminates the time loss associated with manual setup, execution, and teardown of cleaning procedures.
Solution Approach 2:
The cleaning operations are integrated into the continuous manufacturing cycle, utilizing idle periods and transition times for cleaning actions. The system maintains continuous useful action by ensuring that cleaning occurs during otherwise non-productive intervals, thereby reducing total cleaning time without compromising manufacturing output.
3Productivity
If automated in-situ cleaning is implemented to maintain throughput, then productivity is maintained, but device complexity increases
Solution Approach 1:
The robotic manipulator system is designed with multi-functional end effectors that can perform multiple cleaning operations (liquid dispensing, mechanical wiping, ultrasonic cleaning) and can service various chamber components (chuck, chamber walls, nozzles) using the same basic platform. This universality reduces overall system complexity compared to having separate dedicated cleaning systems for each component.
Solution Approach 2:
The cleaning system merges multiple functions into integrated modules: the robotic manipulator combines positioning, delivery, and cleaning execution; the end effectors integrate liquid dispensing, mechanical cleaning elements, and sensor feedback; and the control system unifies scheduling, coordination, and monitoring. This merging approach reduces the number of separate subsystems while maintaining comprehensive cleaning capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The chuck-based device effectively reduces contamination levels within the chamber without disrupting the manufacturing process, thereby enhancing the overall yield and efficiency of semiconductor device production.
Implementation Method 1
A chuck-based device is integrated into the chamber of a semiconductor manufacturing apparatus, capable of dispensing decontamination fluid through multiple openings to clean the chamber surfaces in-situ
Data Source
AI summary
The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber, a chuck housed in the chamber and configured to hold a substrate, and a control device configured to control a translational displacement and a rotation of the chuck. The chuck can include a passage extending along a periphery of the chuck and dividing the chuck into an inner portion and an outer sidewall portion, and a first multiple of openings through the outer sidewall portion of the chuck and interconnected with the passage. The passage can be configured to transport a fluid. The first multiple of openings can be configured to dispense the fluid.