Electrostatic Chuck Focus Ring Cleaning for By-Product Buildup
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Solution Overview
Problem
By-products generated during plasma processes in substrate treatment accumulate between the electrostatic chuck and focus ring, leading to arcing and poor cleaning efficiency, which shortens preventive maintenance cycles and reduces semiconductor yield.
Innovation Solution
A substrate treating apparatus with a by-product removal unit comprising an inert gas supply module and drain module to spray inert gas and remove by-products between the dielectric layer and focus ring, using independent pressure control and multiple gas and by-product moving lines to prevent deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If in-situ dry cleaning (ISD) process is performed to remove by-products, then cleaning of the process chamber is achieved, but by-products remain deposited between the electrostatic chuck and focus ring
Solution Approach 1:
The patent introduces a by-product removal unit that actively removes by-products from the area between the electrostatic chuck and focus ring during the plasma treatment process itself, before they can accumulate and cause arcing. This preliminary action prevents the formation of harmful deposits rather than attempting to clean them afterward.
Solution Approach 2:
The invention extracts the by-product removal function as a separate unit with dedicated gas supply and exhaust pathways. The by-product removal unit includes a gas supply unit that introduces cleaning gas into the gap between the electrostatic chuck and focus ring, and an exhaust unit that removes the by-products, separating this function from the main plasma treatment and ISD processes.
2Reliability
If by-products are removed during the treating process using additional gas supply and exhaust units, then by-product deposition is prevented, but device complexity increases
Solution Approach 1:
The by-product removal unit is designed to work concurrently with the plasma treatment process, serving multiple functions: it removes by-products during treatment, prevents arcing between the electrostatic chuck and focus ring, and reduces the need for frequent intensive cleaning cycles. The gas supply and exhaust pathways are integrated into the existing chamber structure where possible.
Solution Approach 2:
The patent uses an intermediary gas flow mechanism to transport by-products from the difficult-to-reach area between the electrostatic chuck and focus ring to the exhaust unit. The cleaning gas acts as a mediator that flushes out by-products without requiring direct mechanical contact or complex robotic manipulation, simplifying the overall system design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Suppresses by-product deposition, enhancing cleaning efficiency and extending maintenance cycles while maintaining semiconductor product yield by effectively removing by-products during and after treatment.
Implementation Method 1
an inert gas supply module for spraying an inert gas into the area between the dielectric layer and the focus ring
Implementation Method 2
sprays the inert gas at high pressure which is higher than a pressure for supplying a refrigerant to a cooling member installed in the electrostatic chuck
Implementation Method 3
a drain module for removing the by-product from the area between the dielectric layer and the focus ring
Implementation Method 4
removes the by-product while the substrate is treated or the electrostatic chuck and the focus ring are cleaned after the treatment of the substrate is completed
Implementation Method 5
an electrostatic chuck supporting a substrate
Implementation Method 6
a plasma generating unit generating plasma for treating the substrate inside the chamber housing by using the process gas
Data Source
AI summary
A substrate treating apparatus and method is provided, in which deposition of a by-product on an area between a focus ring and a dielectric layer included in an electrostatic chuck may be suppressed during a treating process of the substrate or a cleaning process of a process chamber. The substrate treating apparatus comprises an electrostatic chuck supporting a substrate; a focus ring surrounding an outer edge area of a dielectric layer included in the electrostatic chuck; and a by-product removal unit preventing a by-product generated in a process of treating the substrate from being adsorbed or remaining in an area between the dielectric layer and the focus ring.