Substrate Chuck Gas Flow for Condensation Reduction
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Solution Overview
Problem
Condensation on substrate holder surfaces during low-temperature processing operations in semiconductor manufacturing can impair equipment operation and reduce its lifespan, as existing temperature-controlled chucks do not effectively manage ambient air moisture and pressure variations.
Innovation Solution
A substrate processing chuck design featuring a gas flow system that uses a dry gas, such as nitrogen, to purge ambient air and moisture from the chuck, with channels and grooves guiding the gas flow to prevent condensation, and a thermally coupled structure for precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is used to remove plasma power heat from the chuck, then heat removal capability is improved, but condensation occurs on the chuck surfaces during low-temperature processing
Solution Approach 1:
The chuck is divided into multiple temperature zones with independent heating and cooling capabilities. Different regions can be maintained at different temperatures, allowing the processing surface to be kept warm while other parts provide cooling, thus preventing condensation while maintaining heat removal capability
Solution Approach 2:
The system dynamically adjusts temperature parameters across different chuck regions based on processing requirements. By changing temperature parameters locally rather than uniformly, the chuck can prevent condensation on exposed surfaces while maintaining effective cooling where needed
2Adaptability or versatility
If a single chuck is used for multiple temperature processes, then equipment versatility is improved, but condensation impairs operation and reduces lifespan
Solution Approach 1:
The chuck is designed with integrated heating elements, cooling channels, and moisture management systems that enable it to perform multiple functions: temperature control for different processes, condensation prevention, and lifespan extension through reliable operation across temperature ranges
Solution Approach 2:
A gas flow system acts as an intermediary between the chuck surfaces and ambient moisture. The gas flow prevents condensation by creating a protective barrier, allowing the chuck to operate reliably across multiple temperature processes without moisture-related damage
3Power
If cooling channels are added to the chuck structure, then heat removal capability is improved, but device complexity increases
Solution Approach 1:
The cooling channels are merged with the heating elements and structural components of the chuck into an integrated system. This consolidation allows heat removal functionality to be added without proportionally increasing overall complexity, as the cooling infrastructure shares space and components with existing chuck structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces condensation within the chuck, maintaining equipment reliability and operational lifespan by managing ambient air moisture and pressure variations, allowing for a wide range of temperature processes without the need for multiple holders.
Implementation Method 1
a cooling plate fastened to and thermally coupled to the top plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate
Implementation Method 2
a dry gas outlet of the base plate to supply a dry gas under pressure to a space between the base plate and the cooling plate to drive ambient air from between the base plate and the cooling plate
Data Source
AI summary
A gas flow is described to reduce condensation with a substrate processing chuck. In one example, a workpiece holder in the chamber having a puck to carry the workpiece for fabrication processes, a top plate thermally coupled to the puck, a cooling plate fastened to and thermally coupled to the top plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate, a base plate fastened to the cooling plate opposite the puck, and a dry gas inlet of the base plate to supply a dry gas under pressure to a space between the base plate and the cooling plate to drive ambient air from between the base plate and the cooling plate.