Chuck Vacuum Line Layout for Low-Buildup Semiconductor Pumping
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Solution Overview
Problem
The buildup of processing byproducts in the vacuum chuck and plumbing fixtures of semiconductor processing tools reduces the effectiveness of the vacuum chuck in securing semiconductor devices, leading to decreased productivity due to frequent maintenance needs.
Innovation Solution
An improved chuck vacuum line design with a first portion penetrating the sidewall of the main pumping line and a second portion that is substantially parallel to the sidewall and flow direction, with a size increase from inlet to outlet, which reduces buildup on the interior walls and maintains airflow, preventing clogging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional vacuum chuck and plumbing fixture design is used, then the semiconductor device can be secured in place, but processing byproducts build up in the vacuum chuck and plumbing fixtures, reducing effectiveness and requiring frequent maintenance
Solution Approach 1:
The vacuum chuck is divided into multiple independently removable segments that can be separated from the process chamber body. This segmentation allows each segment to be easily removed and cleaned of processing byproducts without requiring disassembly of the entire chamber, thereby maintaining vacuum effectiveness while reducing maintenance time and frequency.
Solution Approach 2:
The vacuum chuck segments are designed to be extractable from the process chamber body through a dedicated removal mechanism. By taking out the contaminated components (chuck segments and plumbing fixtures) from the main system, maintenance can be performed externally without affecting the overall chamber integrity or requiring full chamber disassembly, thus improving productivity.
2Reliability
If the vacuum chuck is cleaned frequently to maintain effectiveness, then processing byproduct buildup is reduced, but tool downtime increases and productivity decreases
Solution Approach 1:
By segmenting the vacuum chuck into removable sections, cleaning can be performed quickly on individual segments rather than requiring full chamber disassembly. This reduces the time the tool is down for maintenance while maintaining vacuum effectiveness through regular cleaning of segmented components.
Solution Approach 2:
The design allows for preliminary cleaning of vacuum chuck segments during scheduled maintenance intervals before byproduct buildup significantly impacts performance. The easily removable segmented structure enables proactive maintenance with minimal downtime, preventing the need for more extensive cleaning operations later.
3Productivity
If processing byproducts are allowed to build up in plumbing fixtures, then fewer maintenance interruptions occur, but vacuum quality and temperature control uniformity deteriorate
Solution Approach 1:
The plumbing fixtures are integrated with the segmented vacuum chuck design, allowing both to be removed and cleaned together as a unit. This segmentation enables periodic maintenance that restores vacuum quality and temperature uniformity without requiring prolonged operational interruptions, as cleaning can be performed efficiently on the separated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the effectiveness of the vacuum chuck in securing semiconductor devices, reduces maintenance frequency, and improves temperature control and uniformity in the process chamber, thereby increasing the productivity and performance of the semiconductor processing tool.
Implementation Method 1
a pump connected to the main pumping line to cause the process gas to be removed from the process chamber body through the main pumping line
Implementation Method 2
applying a vacuum to a chuck provided within the process chamber body, via a chuck vacuum line connected to the chuck, to retain a semiconductor device against the chuck
Data Source
AI summary
A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.