Chuck Pin and Guide Ring Synchronization for High-Speed Substrate Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face issues such as excessive stress on chuck pins, substrate bending or damage, inefficient liquid recovery, and interference between transfer robots and guide ring units due to high rotational speeds, leading to potential deformation and damage of chuck pins and substrates.
Innovation Solution
The apparatus includes a movable contact part that blocks the chuck pin from moving away from the support plate, a guide ring unit with adjustable height, and a driver that synchronizes the movement of the chuck pin and guide ring unit, using elastic members to manage centrifugal forces and prevent interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the rotational speed of the support unit is increased, then the productivity is improved, but the stress on the chuck pin increases excessively
Solution Approach 1:
The chuck pin is designed to be movable rather than fixed, allowing it to dynamically adjust its position in response to centrifugal forces generated during rotation. The elastic member enables the chuck pin to move outward when centrifugal force increases at high rotational speeds, thereby maintaining contact with the substrate while reducing stress concentration and preventing damage.
2Productivity
If the rotational speed of the support unit is increased, then the productivity is improved, but the substrate may be bent or damaged
Solution Approach 1:
The movable chuck pin with elastic member allows the support structure to adapt dynamically to centrifugal forces, maintaining proper substrate support even at high rotational speeds. This prevents substrate bending or damage by ensuring continuous, appropriate contact force between the chuck pin and substrate edge.
3Loss of substance
If the guide ring unit is positioned adjacent to the substrate for efficient liquid recovery, then the liquid recovery efficiency is improved, but it interferes with the transfer robot
Solution Approach 1:
The guide ring unit is designed to be movable and is positioned dynamically based on operational requirements. During substrate treatment, the guide ring moves to a position adjacent to the substrate for efficient liquid recovery. During substrate loading and unloading, the guide ring moves to a retracted position that eliminates interference with the transfer robot, thus resolving the spatial conflict.
4Strength
If the contact maintaining member is added to compensate for chuck pin support force, then the support force is maintained, but the centrifugal force becomes excessive at high speeds
Solution Approach 1:
Instead of using a fixed contact maintaining member that generates excessive centrifugal force, the invention uses a movable chuck pin supported by an elastic member. This dynamic system allows the chuck pin to move outward with the centrifugal force rather than resisting it, thereby maintaining support force without generating excessive counteracting centrifugal force that would damage the chuck pin.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents excessive stress on chuck pins, reduces substrate damage, enhances liquid recovery efficiency, and eliminates interference between the guide ring unit and transfer robots, ensuring stable substrate processing without structural complexity.
Implementation Method 1
a first elastic member installed on the chuck pin support, the first elastic member generates elastic force to move the chuck pin support in the fifth direction
Implementation Method 2
when supporting the side of the substrate, as a rotational speed of the support unit increases, the support force of the chuck pin and the centrifugal force applied to the chuck pin may be offset
Data Source
AI summary
Disclosed is an apparatus of treating a substrate, which is capable of reducing stress applied to a chuck pin while simultaneously driving a guide ring unit and the chuck pin. The apparatus includes: a cup body having a treatment space therein and an open top; a support unit for supporting a substrate within the treatment space; a liquid supply unit for supplying a treatment liquid to a substrate supported by the support unit; and a contact part provided to be movable in an up and down direction, in which the support unit includes: a support plate on which the substrate is placed and which is provided to be rotatable; a chuck pin provided on the support plate and supporting the substrate on a side portion of the substrate; and a chuck pin support that is coupled to the chuck pin and supports the chuck pin, and the contact part is in contact with an inclined surface formed on the chuck pin support when the contact part rises, the chuck pin is provided to move between a spaced position and a support position by an up and down movement of the contact part, the spaced position is a position spaced apart from the substrate supported by the support unit, and the support position is a position that supports the side portion of the substrate supported by the support unit.