Electrostatic Chuck Pin Positioning for Local Potential Regulation

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Solution Overview

Problem

Electrical arcing between a semiconductor substrate and components of a semiconductor processing tool can occur due to uneven electrical potential, leading to damage to both the substrate and the tool, reducing yield and increasing downtime.

Innovation Solution

A voltage-regulation system that positions electrically-conductive pins within the substrate's region to adjust and maintain an electrical potential within a threshold, preventing arcing by neutralizing or reducing the potential, using a combination of pin-positioning and power supply control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an electrostatic chuck is used to support the semiconductor substrate, then the substrate can be temporarily captured and positioned for processing, but electrical arcing may occur between the substrate and tool components due to uneven electrical potential

Engineering Contradiction:
Improvesubstrate positioning stabilityVSAvoidelectrical arcing
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by placing conductive pins at specific locations on the electrostatic chuck surface where electrical potential needs to be regulated. These pins create localized electrical contact points that neutralize charge buildup in specific regions, allowing different areas of the substrate to have different electrical characteristics as needed to prevent arcing while maintaining overall positioning stability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The conductive pins serve as intermediaries between the electrostatic chuck and the semiconductor substrate. They mediate the electrical interaction by providing controlled charge transfer pathways, allowing the system to regulate electrical potential without direct substrate-chuck contact that would cause arcing. The pins act as a buffer that manages the electrical interface.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If conductive pins are positioned within the substrate region to regulate electrical potential, then electrical arcing is prevented, but the device complexity increases

Engineering Contradiction:
Improveelectrical arcing preventionVSAvoidvoltage regulation system complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The voltage regulation system operates autonomously by continuously monitoring electrical potential through sensors and automatically adjusting pin positions and charges without external intervention. The system self-regulates by detecting potential issues and correcting them in real-time, reducing the need for complex external control mechanisms while maintaining effective arcing prevention.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent changes electrical parameters dynamically by adjusting the position, charge, and configuration of conductive pins based on real-time measurements of electrical potential. This parameter adjustment approach allows the system to adapt to varying conditions and prevent arcing without requiring a completely complex system architecture, as the same pins can be reconfigured for different regulatory needs.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If voltage regulation is continuously monitored and adjusted, then electrical arcing is prevented and yield increases, but the operation time and processing duration increase

Engineering Contradiction:
Improvearcing prevention effectivenessVSAvoidprocessing cycle time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The voltage regulation system uses periodic monitoring and adjustment cycles rather than continuous operation. Sensors periodically measure electrical potential, and the control system makes adjustments at intervals when needed. This periodic approach maintains effective arcing prevention while allowing normal processing to proceed uninterrupted during regulation cycles, minimizing time loss.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The system rapidly performs voltage regulation adjustments and quickly returns to normal processing mode. When electrical potential issues are detected, the system rushes through the correction process by quickly positioning and charging pins, then immediately resuming substrate processing. This minimizes the time spent in regulation mode while ensuring arcing is prevented.

Inventive Principle:
Principle #21Skipping (Rushing through)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces the likelihood of electrical arcing, thereby increasing the yield of semiconductor devices, maintaining tool uptime, and enhancing manufacturing throughput by ensuring the electrical potential satisfies a predetermined threshold.

Implementation Method 1

an electrostatic chuck (ESC) that supports a semiconductor substrate for processing

Methodology Applied
Scientific EffectElectrostatic force: Electrostatics

Implementation Method 2

one or more electron beams of the SEM may scan the semiconductor substrate for defects

Methodology Applied
Scientific EffectElectron beam: Electron Beam

Implementation Method 3

position one or more electrically-conductive pins within the region. The one or more electrically-conductive pins may change the electrical potential of the region

Methodology Applied
Scientific EffectElectrical charge transfer: Conduction (electrical)

Data Source

PatentUS11764094B2Semiconductor processing tool and methods of operation
Publication Date: 2023.09.19 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US11764094B2 patent drawing
  • US11764094B2 patent drawing
  • US11764094B2 patent drawing

AI summary

Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.