Electrostatic Chuck Protector for Edge Ring Plasma Cleaning
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Solution Overview
Problem
In substrate processing apparatuses, by-products deposited between the mounting portion and edge ring during etching processes are difficult to remove effectively, affecting the cleaning efficiency and potentially altering the etching process characteristics.
Innovation Solution
A method involving a protecting member with a small diameter portion covering the substrate mounting portion and a large diameter portion positioned apart from the edge ring, which is used in conjunction with a cleaning gas to remove by-products, utilizing the plasma cleaning process to enhance the removal rate while protecting the substrate mounting surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a plasma cleaning method is used to remove by-products from the processing container, then the cleaning coverage is improved, but the substrate mounting surface may be damaged by direct plasma exposure
Solution Approach 1:
A protecting member is introduced as an intermediary between the plasma cleaning process and the substrate mounting surface. This protecting member has a through-hole structure that allows plasma to reach the gap between the mounting portion and edge ring for cleaning, while simultaneously shielding the substrate mounting surface from direct plasma exposure. The protecting member thus mediates the conflict between cleaning effectiveness and surface protection.
Solution Approach 2:
The protecting member is designed with differential plasma exposure characteristics: the gap region between the mounting portion and edge ring is exposed to plasma for effective cleaning, while the substrate mounting surface is protected from plasma. This local differentiation of plasma exposure quality enables selective cleaning without damage to the substrate mounting surface.
2Productivity
If cleaning gas is supplied to remove by-products between the mounting portion and edge ring, then the by-product removal is improved, but the plasma may directly expose and damage the substrate mounting surface
Solution Approach 1:
The protecting member serves as a mediator that directs plasma flow through its through-hole structure. It allows plasma to access the gap region for effective by-product removal while simultaneously acting as a physical barrier that prevents plasma from directly exposing the substrate mounting surface, thus maintaining surface integrity.
Solution Approach 2:
The protecting member segments the plasma flow path into two distinct regions: a cleaning zone where plasma contacts the gap between mounting portion and edge ring to remove by-products, and a protected zone where the substrate mounting surface is shielded from plasma. This segmentation enables simultaneous by-product removal and surface protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively removes by-products deposited between the substrate mounting portion and edge ring, improving the cleaning efficiency and maintaining the integrity of the substrate mounting surface during the plasma cleaning process.
Implementation Method 1
a plasma cleaning method in which a cleaning process is performed to remove by-products from each member in a processing container
Data Source
AI summary
A method for cleaning a substrate processing apparatus includes mounting a substrate on a mounting portion of an electrostatic chuck of the substrate processing apparatus to process the substrate; mounting a protector including a small diameter portion that covers the mounting portion and a large diameter portion that is disposed apart from an edge ring disposed on an outer periphery of the mounting portion and has a diameter larger than that of the small diameter portion, on the mounting portion; and supplying a cleaning gas, thereby removing by-products deposited between the mounting portion and the edge ring.