Electrostatic Chuck Protrusions and Grooves for Lifted Substrate Edges
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Solution Overview
Problem
Existing deposition processes can cause damage to the substrate due to the lifting phenomenon during the deposition process, leading to potential substrate damage when the edge of the substrate collides with the electrostatic chuck.
Innovation Solution
The deposition apparatus includes a support, clamp, and an electrostatic chuck with protrusions and grooves on its bottom surface to prevent substrate damage by accommodating the substrate edge within the grooves, thereby preventing contact with the chuck.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrostatic chuck is used to hold the substrate during deposition, then the substrate can be securely fixed, but the substrate edge may collide with the chuck and cause damage
Solution Approach 1:
The electrostatic chuck surface is segmented into protrusions and grooves. The protrusions provide fixation points while the grooves create protective recesses that accommodate the substrate edge, preventing direct contact and damage between the substrate edge and the chuck surface.
Solution Approach 2:
The grooves are designed in advance to accommodate the substrate edge before any collision can occur. This pre-positioned cushioning structure prevents the harmful collision by providing a recessed space that absorbs the edge of the substrate, eliminating the damage risk.
2Strength
If the clamp is positioned to secure the substrate edge, then the substrate can be firmly held, but it may cause stress concentration at the substrate edge
Solution Approach 1:
The clamp applies localized pressure at specific points rather than uniformly across the substrate edge. By concentrating the holding force at discrete locations, the substrate is firmly secured while avoiding excessive stress concentration that would occur with continuous clamping pressure.
Solution Approach 2:
The electrostatic chuck with its protrusion-groove structure acts as an intermediary between the clamp and the substrate edge. The grooves provide a cushioning interface that distributes the clamping force, reducing stress concentration while maintaining firm holding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents substrate damage by ensuring the substrate edge is contained within the grooves, maintaining the integrity of the substrate during the deposition process.
Implementation Method 1
an electrostatic chuck including a flat part and a plurality of protrusions
Data Source
AI summary
A deposition apparatus includes: a support, which is disposed on a bottom surface of a substrate to overlap an edge of the substrate in a plan view; a clamp disposed on the support and the edge of the substrate; and an electrostatic chuck including a flat part and a plurality of protrusions, where the flat part is configured to be disposed on a top surface of the substrate and the plurality of protrusions protrude from an edge of the flat part. A part of the clamp is disposed between protrusions adjacent to each other among the plurality of protrusions, and a groove is defined in a bottom surface of each of the plurality of protrusions and configured to overlap the edge of the substrate in the plan view.