Electrostatic Chuck Recess Layout for Laser-Induced Particle Control
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Solution Overview
Problem
Laser beams used in etching processes during the manufacture of display devices can cause damage to substrates, leading to peeling of particles and reduced processing quality.
Innovation Solution
The use of an electrostatic chuck with a recessed groove structure on its lower surface, which reduces the energy of the laser beam before it reaches the chuck, thereby minimizing damage and allowing for multiple substrates to be processed without replacing the chuck, thus improving etching efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional electrostatic chuck without recesses is used, then the chuck can maintain a flat surface for substrate support, but the laser beam passes through the substrate and damages the chuck surface, causing particle peeling
Solution Approach 1:
The patent introduces grooves as an intermediary structure between the substrate and the chuck surface. These grooves create a physical buffer zone that intercepts the laser beam before it reaches the chuck surface, thereby protecting the chuck from laser-induced damage while maintaining the electrostatic holding function.
Solution Approach 2:
The patent converts the harmful laser beam energy into a beneficial effect by using the grooves to absorb and dissipate the laser energy. The grooves act as energy sinks that capture the laser beam's harmful effects and convert them into harmless thermal energy or scattered light, preventing damage to the chuck surface.
2Manufacturing precision
If the chuck surface is damaged by laser beams, then particle peeling occurs on the substrate, but replacing the chuck between substrates reduces processing efficiency
Solution Approach 1:
The patent applies preliminary action by pre-forming grooves on the chuck surface before substrate processing begins. This preventive measure ensures that when laser beam processing occurs, the damage is contained within the grooves and does not affect the substrate quality, eliminating the need for chuck replacement between substrates.
Solution Approach 2:
The patent applies local quality by creating grooves only in specific areas of the chuck surface where laser beam exposure occurs. The grooved regions are localized to the processing areas, while other regions maintain their original flat surface properties for proper substrate contact and electrostatic holding.
3Productivity
If grooves are formed on the chuck surface to protect against laser damage, then the chuck can be reused for multiple substrates, but the groove structure increases manufacturing complexity
Solution Approach 1:
The patent applies segmentation by dividing the chuck surface into distinct regions: grooved areas for laser protection and flat areas for substrate contact. This segmentation allows the chuck to perform multiple functions simultaneously - protecting against laser damage while maintaining proper substrate holding and processing capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces damage to the electrostatic chuck and enhances the reliability and efficiency of the etching process by preventing particle peeling and allowing for continuous processing without chuck replacement.
Implementation Method 1
a chuck for supporting a target substrate for a display device
Data Source
AI summary
The chuck for supporting a target substrate for a display device, the chuck includes: a base having a first surface to support an object and a second surface opposite the first surface, the first surface including a first area and a second area; and indentations formed in the second area and recessed from the first area in a thickness direction of the base. The indentations include a first indentation extending in a first direction and a second indentation extending in a second direction intersecting the first direction.