Chuck Electrical Isolation via Recessed Edge Design
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Solution Overview
Problem
In atomic layer deposition (ALD) processes, the conductive films deposited on substrate holders and electrical insulation layers can create shorts between the conductive substrate holder and the grounded chuck body due to conformal coating, which is problematic for substrate-biased ALD applications.
Innovation Solution
A chuck system with an electrical isolating layer featuring a recessed edge design, where the edge recess has a specific aspect ratio to prevent the conductive film from coating the entire interior, maintaining electrical isolation between the substrate holder and the chuck base, and using materials that can withstand ALD process temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the ALD process uses conformal coating to deposit conductive films, then the film coverage and uniformity are improved, but short circuits occur between the substrate holder and grounded chuck body
Solution Approach 1:
The electrical isolating layer is segmented by forming edge recesses that create discontinuities in the coating path. The recesses divide the continuous isolating layer surface into separate regions, preventing the conformal ALD coating from creating a continuous conductive path between the substrate holder and grounded chuck body.
Solution Approach 2:
The electrical isolating layer acts as an intermediary barrier between the conductive substrate holder and the grounded chuck body. By modifying this intermediary with edge recesses, the patent prevents the conductive film from bridging the gap, maintaining electrical isolation while allowing the ALD process to proceed.
2Device complexity
If the electrical isolating layer is made thin to reduce complexity, then the device structure is simplified, but the isolating layer cannot prevent short circuits when coated conformally
Solution Approach 1:
Instead of increasing the thickness of the isolating layer in the vertical dimension, the patent introduces edge recesses that create a depth dimension. This dimensional modification to the isolating layer structure prevents conformal coating from creating short circuits without requiring excessive thickness, thus avoiding the need for thick, complex isolating layers.
3Reliability
If the edge recess is made deep to ensure electrical isolation, then short circuit prevention is improved, but the isolating layer material requirements become more stringent
Solution Approach 1:
The patent optimizes the parameters of the edge recess, specifically the aspect ratio (depth to width), to achieve effective electrical isolation without requiring extreme depth. By carefully selecting the aspect ratio within a specific range, the design balances short circuit prevention with reasonable material selection criteria, avoiding the need for specialized materials that can withstand extreme geometric constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The recessed edge design effectively prevents short circuits by allowing the conductive film to only partially coat the isolating layer, maintaining electrical isolation and ensuring the integrity of the ALD process, while the temperature-resistant materials ensure the structural and functional stability of the isolating layer.
Implementation Method 1
an electrical isolating layer sandwiched between the electrically conductive substrate holder and the electrically conductive base
Implementation Method 2
Atomic Layer Deposition (ALD) is a thin film deposition technique that sequentially exposes a substrate with multiple, distinct chemical and/or energetic environments to form a film on the substrate surface
Implementation Method 3
The metal is chemisorbed with the preexisting chemical moieties on the substrate surface
Data Source
AI summary
A chuck system for performing a substrate-biased atomic layer deposition process that forms an electrically conductive film on a substrate includes an electrically conductive substrate holder configured to support the substrate and an electrically conductive base that supports the substrate holder. An electrical isolating layer is sandwiched between the substrate holder and the base. The electrical isolating layer has an outer end and an edge recess formed in and that runs around the outer edge. The edge recess is configured to prevent the electrically conductive film from coating the entire interior of the edge recess, thereby maintaining electrical isolation between the substrate holder and the base.