Chuck Segments for Nanometric Substrate Positioning

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing methods for positioning an image sensor relative to a substrate during manufacturing or inspection processes face accuracy and force challenges due to substrate elevation, which results in navigation errors and vibrations, especially when high precision within nanometric scales is required.

Innovation Solution

A support module with independently movable chuck segments and piezoelectric motors that perform nanometric scale elevation and lowering movements, along with additional piezoelectric motors to counter movements and compensate for tilt errors, is used to accurately position the substrate with reduced force and increased precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the entire substrate is elevated or lowered to position the image sensor, then the image sensor can be positioned at the required distance from the substrate, but the positioning accuracy deteriorates and navigation errors increase

Engineering Contradiction:
Improvepositioning accuracyVSAvoidnavigation accuracy
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The chuck is divided into multiple independently controllable segments. Instead of elevating or lowering the entire substrate, only specific chuck segments are moved vertically to adjust the position of local substrate areas. This segmentation allows precise local positioning without affecting the global substrate orientation, thereby eliminating navigation errors while achieving the required positioning accuracy.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are treated differently through independent chuck segment control. Each chuck segment can be positioned with nanometric precision to accommodate local requirements of the image sensor positioning, while other regions remain undisturbed. This local quality approach ensures high positioning accuracy without introducing global navigation errors.

Inventive Principle:
Principle #3Local quality

2Speed

If the entire substrate is elevated or lowered during positioning, then the image sensor distance can be adjusted, but the positioning duration increases and substantial forces are required

Engineering Contradiction:
Improvepositioning speedVSAvoidpositioning duration
Core Design Contradiction:
SpeedVSDuration of action of moving object

Solution Approach 1:

By segmenting the chuck into independently controllable parts, only the necessary substrate areas are moved during positioning. This reduces the mass that needs to be accelerated and decelerated, thereby increasing positioning speed and reducing the time required for the positioning operation compared to moving the entire substrate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of moving the entire substrate (excessive action), only the specific chuck segments supporting the areas of interest are moved (partial action). This reduces the inertial effects and forces required, enabling faster positioning with shorter duration while achieving the same imaging goal.

Inventive Principle:
Principle #16Partial or excessive action

3Force

If the entire substrate is elevated or lowered, then the image sensor positioning can be achieved, but substantial forces must be applied to the substrate

Engineering Contradiction:
Improvepositioning forceVSAvoidsubstrate stress
Core Design Contradiction:
ForceVSObject-affected harmful factors

Solution Approach 1:

The chuck segments are designed to move independently with small displacements. This segmentation allows the positioning force to be concentrated on local areas rather than distributed across the entire substrate. The forces required to move small chuck segments are substantially lower than those needed to move the complete substrate, reducing mechanical stress and potential damage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system changes the positioning parameter from global substrate displacement to local chuck segment displacement. This parameter change reduces the mass being moved and consequently the forces required, while achieving the same effect of positioning the image sensor at the correct distance from the substrate surface.

Inventive Principle:
Principle #35Parameter changes

4Measurement precision

If the stage has pitch or tilt errors, then the interferometer measurement may be affected, but X and Y navigation errors result that amplify with lever arm length

Engineering Contradiction:
Improveinterferometer measurement accuracyVSAvoidX and Y navigation accuracy
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

By using independently controllable chuck segments, the system can locally compensate for pitch and tilt errors without moving the entire substrate. Each segment can be adjusted to maintain the correct local orientation, preventing the amplification of angular errors over the lever arm length while preserving interferometer measurement accuracy.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of trying to maintain perfect global stage alignment and compensate for errors, the system inverts the approach by allowing local orientation adjustments at the chuck segment level. This local compensation eliminates the need for perfect global alignment, reducing navigation errors while maintaining measurement precision.

Inventive Principle:
Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the accuracy and speed of substrate positioning, reduces the required forces, and minimizes navigation errors, enabling precise image acquisition by moving only selected areas of the substrate, thus improving the overall positioning process.

Implementation Method 1

The vertical stage may include multiple piezoelectric motors. Each piezoelectric motor may be configured to perform nanometric scale elevation and lowering movements.

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

The support module may include a controller for controlling the multiple piezoelectric motors thereby compensating for a tilt error of an area of the substrate.

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS10446434B2Chuck for supporting a wafer
Publication Date: 2019.10.15 APPL MATERIALS ISRAEL LTD
  • US10446434B2 patent drawing
  • US10446434B2 patent drawing
  • US10446434B2 patent drawing

AI summary

According to an embodiment, a support module is provided for supporting a substrate. The support module may include a chuck and a vertical stage. The chuck may include multiple chuck segments that are independently movable. When the substrate is positioned on the chuck, different chuck segments are positioned under different areas of the substrate. The vertical stage may include multiple piezoelectric motors. Each piezoelectric motor may be configured to perform nanometric scale elevation and lowering movements. The multiple piezoelectric motors may be configured to independently move the multiple chuck segments.