Chuck Stage Particle Detection via Sequential Vacuum Segmentation
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Solution Overview
Problem
The presence of particles between the wafer and the chuck stage during semiconductor testing can cause damage to the wafer or degrade the quality of the semiconductor pattern, as existing technologies lack effective methods for detecting and addressing these particles.
Innovation Solution
A chuck stage particle detection device is designed with a series of adsorption holes and modules that provide vacuum pressure, coupled with a pressure gauge and detection module to determine if the wafer is properly fixed and if particles are present based on measured pressure variations, using methods like window segmentation and hysteresis to optimize detection accuracy and power efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If vacuum pressure is applied to detect particles on the chuck stage, then particle detection capability is improved, but the complexity of the detection system increases
Solution Approach 1:
The detection system is segmented into multiple adsorption holes arranged in different regions (first region closer to center, second region farther from center), allowing particle detection to be performed in a distributed manner across the chuck stage surface, which improves detection capability while keeping each individual sensor simple
Solution Approach 2:
The patent introduces a pressure gauge as an intermediary device that measures vacuum pressure at multiple adsorption holes. This intermediary translates complex particle presence information into simple pressure readings, enabling particle detection without requiring complex direct sensing mechanisms at each adsorption hole
2Measurement precision
If sequential vacuum pressure is applied to multiple adsorption holes for particle detection, then detection accuracy is improved, but the time required for detection increases
Solution Approach 1:
The adsorption module applies vacuum pressure sequentially to different adsorption holes in a periodic manner rather than simultaneously. This allows the system to detect particles at multiple locations while managing the time required by cycling through regions systematically, balancing detection accuracy with acceptable detection time
Solution Approach 2:
The system performs preliminary vacuum pressure application to the first region (closer to center) before proceeding to the second region (farther from center). This preliminary action allows early detection of particles in critical areas while establishing a systematic approach that can be optimized for time efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively detects the presence of particles and ensures proper wafer fixation, preventing damage and ensuring the quality of semiconductor patterns by accurately determining the presence of particles and adjusting vacuum pressure accordingly.
Implementation Method 1
a first adsorption module connected to the first adsorption hole under the chuck stage and configured to provide a vacuum pressure, a second adsorption module connected to the second adsorption hole under the chuck stage and configured to provide a vacuum pressure
Data Source
AI summary
A particle detection device includes a chuck stage on which a wafer is configured to be seated, first and second adsorption holes shaped as closed concentric curves passing through the chuck stage, a first adsorption module connected to the first adsorption hole under the chuck stage and configured to provide a vacuum pressure, a second adsorption module connected to the second adsorption hole under the chuck stage and configured to provide a vacuum pressure, a pressure gauge configured to measure vacuum pressures of the first and second adsorption holes and a detection module configured to receive the vacuum pressures of the first and second adsorption holes from the pressure gauge and detect whether the wafer is fixed or not and whether particle is present or not, based on the received vacuum pressures. The first and second adsorption modules sequentially provide the vacuum pressure to the first and second adsorption holes.