Chuck Table With Elastic Outer Support For Wafer Suction
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Solution Overview
Problem
Semiconductor wafers with flip chip bonding type electrode bumps on the front side experience negative pressure leakage when held under suction by a chuck table, preventing sufficient attraction due to protruding bumps.
Innovation Solution
A chuck table design featuring a holding surface with an elastic outer peripheral extra region support that projects beyond the surface to match the height of electrode bumps, combined with a flexible sheet member for protection and adjustable height adjustment, ensuring a seal and effective suction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the front side of the wafer with electrode bumps is held under suction on the chuck table, then the wafer can be positioned for processing, but the electrode bumps cause negative pressure leakage preventing sufficient attraction
Solution Approach 1:
An elastic member (O-ring) is introduced as an intermediary sealing element between the wafer and the chuck table. This O-ring fits around the electrode bumps and creates a seal that prevents negative pressure leakage, allowing the suction to effectively hold the wafer in place during processing.
2Object-affected harmful factors
If a sheet member is used to cover the holding surface to protect devices, then device protection is improved, but the sheet member must be larger than the wafer requiring additional space
Solution Approach 1:
The sheet member is made flexible and can be dynamically adjusted during the process. It is lowered to cover only the necessary areas (holding surface and outer peripheral extra region support) and secured in position, allowing it to adapt to the wafer size while providing adequate protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design prevents negative pressure leakage, securely holds wafers with electrode bumps under suction, protects the wafer surface, and allows for adjustable height support to accommodate varying bump heights without needing multiple chuck tables.
Implementation Method 1
an outer peripheral extra region support surrounding the holding surface and including an elastic member projecting beyond the holding surface for supporting the outer peripheral extra region of the wafer
Implementation Method 2
a holding surface for facing the electrode bumps and holding under suction the device region of the wafer
Data Source
AI summary
A chuck table holds under suction a front side of a wafer which includes a device region including a plurality of devices, each having a plurality of electrode bumps, formed in a plurality of areas demarcated in a grid pattern, and an outer peripheral extra region surrounding the device region. The chuck table includes a holding surface for facing the electrode bumps and holding under suction the device region of the wafer, and an outer peripheral extra region support surrounding the holding surface and including an elastic member projecting beyond the holding surface for supporting the outer peripheral extra region of the wafer. The outer peripheral extra region support projects from the holding surface by a distance corresponding to the height of the electrode bumps.