Chuck Table Porous Plate Layout for Multi-Size Wafer Holding
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Solution Overview
Problem
Conventional chuck table manufacturing methods require multiple steps to individually produce porous plates of specific shapes, leading to low productivity.
Innovation Solution
A method involving a porous plate sticking step, groove forming, resin filling, and holding surface forming to create a chuck table capable of adapting to different workpiece sizes and shapes without separately manufacturing porous plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If porous plates of specific shapes are individually manufactured for different wafer sizes, then the chuck table can hold different sized workpieces, but the number of working steps increases and productivity decreases
Solution Approach 1:
A single porous plate is designed to serve multiple functions by accommodating different wafer sizes through groove configurations. The plate includes a first groove for 6-inch wafers and a second groove for 12-inch wafers, eliminating the need to manufacture separate porous plates for each wafer size and thereby improving productivity while maintaining versatility
Solution Approach 2:
The porous plate is segmented into multiple functional regions with different groove patterns. The first groove region handles smaller wafers while the second groove region handles larger wafers, allowing one plate to replace multiple specialized plates through internal segmentation of functionality
2Adaptability or versatility
If multiple porous plates and barriers are individually manufactured and assembled, then the chuck table can accommodate different wafer sizes, but the manufacturing process complexity increases
Solution Approach 1:
Multiple functional elements are merged into a single porous plate structure. Instead of assembling separate porous plates and barriers for different wafer sizes, the invention integrates multiple groove patterns into one plate, reducing assembly steps and manufacturing process complexity while maintaining the ability to accommodate different wafer sizes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances productivity by reducing the number of working steps and enabling efficient adaptation to various workpiece sizes and shapes.
Implementation Method 1
filling the groove with a liquid resin and curing the liquid resin
Implementation Method 2
a holding surface thereof is made to communicate with a suction source, and a wafer is held on the holding surface
Data Source
AI summary
A chuck table manufacturing method capable of changing over the shape of a holding surface according to at least two workpieces different in area or shape includes a porous plate sticking step of sticking a frame body and a porous plate to each other while the porous plate is accommodated in a recess of the frame body with an upper surface of the porous plate being exposed, a groove forming step of forming, in the porous plate, a groove reaching a bottom surface of the recess, and a resin filling step of filling the groove with a liquid resin and curing the liquid resin.