Chuck Table Scrap Fixing to Protect Solder Balls During Cutting
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Solution Overview
Problem
During the cutting process of semiconductor packages, damage to solder balls occurs due to scrap material, which affects the integrity and functionality of the packages.
Innovation Solution
A chuck table with a support part, package pad, scrap pad, vacuum pipe, and a fixing device is used. The vacuum pipe applies and releases vacuum pressure to adsorb and release the package substrate, while the fixing device positions and fixes the scrap area, preventing it from splashing and damaging the solder balls during cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum pressure is applied to hold the package substrate during cutting, then the substrate is securely fixed, but scrap material splashes and damages solder balls
Solution Approach 1:
The pad part is divided into two distinct segments: a package pad part that contacts the package area and a scrap pad part that contacts the scrap area. This segmentation allows independent control and function assignment, enabling the scrap pad part to specifically address scrap material management while the package pad part maintains substrate fixation, thereby resolving the contradiction between secure fixation and scrap damage prevention
Solution Approach 2:
The scrap pad part acts as an intermediary element between the vacuum pipe and the scrap area. It mediates the interaction by providing a dedicated contact surface for scrap material, preventing direct contact between scraping forces and solder balls while maintaining overall substrate stability through the vacuum connection, thus protecting solder balls from damage without compromising fixation reliability
2Ease of manufacture
If the chuck table structure is simplified, then manufacturing cost decreases, but scrap material cannot be effectively controlled
Solution Approach 1:
The pad part is divided into two distinct segments: a package pad part that contacts the package area and a scrap pad part that contacts the scrap area. This segmentation allows independent control and function assignment, enabling the scrap pad part to specifically address scrap material management while the package pad part maintains substrate fixation, thereby resolving the contradiction between secure fixation and scrap damage prevention
Solution Approach 2:
The pad part serves multiple functions: it provides vacuum contact for substrate fixation, defines cutting paths, and specifically manages scrap material through the scrap pad part. This multi-functionality allows a single component to address both fixation and scrap control requirements, achieving effective scrap control without significantly complicating the overall chuck table structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces damage to solder balls by preventing scrap material from splashing during the cutting process, thereby improving the reliability and quality of semiconductor packages.
Implementation Method 1
A vacuum pipe extends through the package pad part and extends into the support part. The vacuum pipe has vacuum pressure applied thereto and has the vacuum pressure released therefrom.
Data Source
AI summary
A chuck table includes a support part receiving a package substrate. The package substrate includes a package area having semiconductor packages arranged thereon and a scrap area surrounding the package area. A package pad part is between the support part and the package substrate and directly contacts the package area. A scrap pad part is disposed between the support part and the package substrate and directly contacts the scrap area. A vacuum pipe extends through the package pad part and extends into the support part. The vacuum pipe has vacuum pressure applied thereto and has the vacuum pressure released therefrom. A fixing device is connected to the vacuum pipe. The fixing device moves closer to an upper surface of the scrap area as the vacuum pressure is applied to the vacuum pipe, and moves away from the upper surface of the scrap area as the vacuum pressure is released.