Chuck Table Suction Opening Radial Displacement
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Solution Overview
Problem
Existing chuck tables in semiconductor wafer cleaning systems face issues with wafer assemblies being thrown off during high rotation speeds, leading to damage and rejection due to uneven surfaces and improper suction force application, which exacerbates die cracking and damage post-singulation.
Innovation Solution
A chuck table with improved vacuum functionality is designed, featuring a unitary surface made of engineering plastics, with suction openings radially distributed around the periphery to apply suction force specifically to the tape side of the wafer assembly, reducing the risk of die cracking and enhancing secure attachment during cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If suction openings are positioned on the chuck table, then wafer assembly can be secured during cleaning, but suction force may be applied to the wafer surface causing die cracking
Solution Approach 1:
The chuck table surface is designed with a sunken peripheral portion that creates a localized suction zone only at the periphery, away from the wafer's active area. This allows suction force to be applied locally to the tape carrier edge without contacting the wafer surface, securing the assembly during rotation while preventing die cracking.
2Productivity
If high rotation speeds are used during cleaning, then cleaning efficiency is improved, but wafer assemblies may be thrown off the chuck table
Solution Approach 1:
The suction openings are positioned and configured to engage the tape carrier periphery before high-speed rotation begins. This preliminary securing action ensures that when high rotation speeds are reached for efficient cleaning, the wafer assembly is already firmly held in place by the suction force applied at the periphery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved chuck table effectively secures wafer assemblies with a uniform suction force, reducing the likelihood of wafer damage and die cracking, while also facilitating real-time detection of wafer presence to interrupt the cleaning cycle if improperly seated, ensuring safe and effective cleaning.
Implementation Method 1
the suction opening being in communication with the opening in the first surface such that in use a suction force can be applied via the suction opening
Data Source
AI summary
A chuck table for supporting a wafer assembly during a cleaning process comprising an axis of rotation, a first surface including an opening configured to be in communication with a vacuum source, and a second surface opposing the first surface. The second surface includes a suction opening displaced radially from both the opening in the first surface and the axis, the suction opening being in communication with the opening in the first surface such that in use a suction force can be applied via the suction opening.