Chuck Temperature Compensation for Semiconductor Test Heat Load
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Solution Overview
Problem
Existing test devices face challenges in continuously detecting the temperature of electronic devices during testing, especially when the heat generated by the devices is large, leading to difficulties in controlling the temperature accurately.
Innovation Solution
A control method for a test device that estimates the temperature difference between the chuck and the electronic device based on the heat amount of the device, corrects the target temperature of the chuck, and controls the chuck's temperature accordingly, even when real-time temperature feedback from the device is not available.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is provided on the mounting table to detect the temperature of the electronic device, then the temperature can be detected, but when the heat amount of the electronic device is large, the difference in temperature between the electronic device and the mounting table becomes large, making it difficult to control the temperature accurately
Solution Approach 1:
The patent introduces a thermal model as an intermediary between the mounting table temperature sensor and the electronic device temperature control. The thermal model estimates the electronic device temperature based on the mounting table temperature, power consumption, and thermal resistance parameters, allowing accurate temperature control without direct contact between the sensor and the device.
Solution Approach 2:
The patent replaces the direct mechanical contact temperature measurement approach with a computational thermal model. Instead of physically placing a temperature sensor on the electronic device, the system uses mathematical modeling to estimate the device temperature based on measurable parameters like mounting table temperature and power consumption.
2Measurement precision
If an element for temperature measurement is used to detect the temperature of the electronic device, then the temperature can be measured, but it is difficult to continuously detect the temperature in consideration of a trade-off with a test flow
Solution Approach 1:
The patent extracts the temperature measurement function from the main test flow by using a separate thermal model estimation process. The mounting table temperature is continuously monitored, and the electronic device temperature is estimated through the thermal model without interrupting or slowing down the actual testing process.
Solution Approach 2:
The patent enables continuous temperature monitoring by implementing the thermal model estimation in parallel with the test flow. The system continuously calculates the electronic device temperature based on real-time mounting table temperature data and power consumption information, maintaining uninterrupted temperature surveillance throughout the testing process.
3Manufacturing precision
If the target temperature of the chuck is controlled based on the target temperature of the electronic device, then the temperature control accuracy is improved, but when the temperature difference between the chuck and the electronic device is large, the control accuracy deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-calculating the temperature difference compensation value using the thermal model before adjusting the chuck target temperature. The system estimates what the electronic device temperature would be at the current mounting table temperature, calculates the required compensation, and adjusts the chuck target temperature in advance to achieve accurate temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the temperature controllability of the electronic device under test, ensuring more accurate temperature control and maintaining the set temperature of the device during testing.
Implementation Method 1
a temperature detection unit that detects a temperature of the chip to be tested on the basis of an electrical potential difference between electrode pads corresponding to respective electrodes of an element for temperature measurement
Implementation Method 2
The temperatures of the electronic devices are controlled by a cooling mechanism or a heating mechanism in the mounting table
Implementation Method 3
When a heat-generating type device is measured
Data Source
Figure 1
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Figure 3A~3B
AI summary
There is provided a control method of a test device, the test device comprising a chuck on which an object to be tested is mounted, a tester configured to supply electric power to the object to be tested to test the object to be tested, and a controller configured to control a temperature of the chuck. The control method comprises: when an actual temperature of the object to be tested cannot be fed back, estimating a temperature difference between the temperature of the chuck and the temperature of the object to be tested on the basis of a heat amount of the object to be tested; correcting a target temperature of the chuck on the basis of a target temperature of the object to be tested and the temperature difference; and controlling the temperature of the chuck on the basis of the corrected target temperature of the chuck and an actual temperature of the chuck.