Electrostatic Chuck Temperature Mixing Control With Feed-Forward Sensing
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Solution Overview
Problem
Existing temperature control systems in semiconductor manufacturing devices face challenges in achieving rapid and precise temperature control due to delays and fluctuations in heating media transfer, especially when controlling the temperature of an electrostatic chuck, which affects the throughput and quality of semiconductor wafers.
Innovation Solution
A temperature control system that includes a mixing device with a mixing valve and bypass valves, controlled by a synchronous controller, to stabilize the flow rate and pressure of heating media, and uses feed-forward and feedback control based on a relationship model between reference and mixing unit temperatures to quickly and accurately adjust the mixing ratio.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If heating media is transferred from a heating media mixing unit to an electrostatic chuck, then the temperature of the electrostatic chuck can be controlled, but there is a delay that prevents rapid feedback control
Solution Approach 1:
The patent places a temperature sensor at the output end of the mixing valve to measure mixing unit temperature in advance, before the heating media reaches the electrostatic chuck. This preliminary measurement allows the control device to predict the future temperature of the electrostatic chuck and adjust the mixing ratio proactively, eliminating the delay inherent in traditional feedback control that waits for temperature measurements at the chuck itself.
2Adaptability or versatility
If a mixing valve is used to mix heating media, then temperature control flexibility is improved, but flow rate and pressure fluctuations occur
Solution Approach 1:
The patent implements a synchronous control mechanism where the control device receives real-time mixing unit temperature measurements from the sensor at the mixing valve output. Based on this feedback, the control device dynamically adjusts the mixing ratio to maintain both temperature flexibility and flow/pressure stability, resolving the contradiction between adaptability and stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables rapid and precise temperature control of the electrostatic chuck, enhancing semiconductor manufacturing throughput and wafer quality by minimizing delays and fluctuations in heating media transfer.
Implementation Method 1
a mixing valve configured to mix the low-temperature heating media and the high-temperature heating media at a predetermined mixing ratio and to supply the mixed heating media to a load
Implementation Method 2
a mixing unit temperature sensor disposed at an output end of the mixing valve in the flow path
Implementation Method 3
to control a position of the mixing valve based on the target mixing unit temperature and the mixing unit temperature
Data Source
AI summary
A temperature control system of a semiconductor manufacturing device includes first and second heating media storages that respectively store low-temperature heating media and high-temperature heating media, a mixing device including a mixing valve that mixes the low-temperature heating media and the high-temperature heating media at a predetermined mixing ratio, and a control device. The mixing device provides mixed heating media to a load, and distributes recovered heating media recovered from the load to the first and second heating media storages. The control device is configured to, by performing feed-forward control and feedback control over a mixing unit temperature using a relationship model between a reference temperature representing a temperature of heating media passing through the load and the mixing unit temperature which is a temperature of heating media output by the mixing valve, control the mixing ratio such that the reference temperature has a target reference temperature.